IC Packaging Design & Layout Engineer

The Charles Stark Draper Laboratory, Inc.; Cambridge (MA); On-site; USD 82,300 - 220,000; Full time

Job summary

The Charles Stark Draper Laboratory, Inc. is seeking an IC Packaging Design & Layout Engineer in Cambridge, MA.

You will own end-to-end packaging solutions that meet performance, power, size, and reliability targets for Draper’s next-generation hardware platforms. Responsibilities include leading advanced package concepts, detailed die-to-die routing, SI/PI strategies, and cross-functional collaboration with silicon design, thermal, and manufacturing teams.

Qualifications

• Bachelor's degree in electrical engineering or related field.
• Advanced degree preferred.
• 5–10 years of experience in electrical engineering or related field.

Responsibilities

• Lead concept development for advanced packages (e.g., fan out wafer level, 2.5D/3D interposer, system in package).
• Produce detailed layout for substrates, interposers, and die-to-die routing using Siemens Xpedition.
• Own package-level SI/PI strategy, including high-speed interfaces, PDN design, and decoupling strategy.
• Perform SPICE, EM, and S‑parameter simulations to validate SI, PDN, and crosstalk.
• Collaborate with mechanical, silicon, RF, and board design engineers to optimize layouts.
• Author package build documentation, specifications, and test plans.

Skills

High density packaging layout

Signal integrity best practices

SI/PI analysis tools

Education

Bachelor's degree in electrical engineering

Advanced degree preferred

Tools

Siemens Xpedition

Ansys SIwave

HFSS

Hyperlynx

Job description

Overview

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 2,000+ employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. For more information about Draper, visit www.draper.com.

Job Description Summary

The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability targets for Draper’s next generation hardware platforms. The role requires deep technical expertise in package architecture, high speed layout, signal integrity analysis, and design for manufacturability (DFM). The engineer will collaborate with cross functional teams—including silicon design, thermal/mechanical analysts, and manufacturing—to deliver manufacturable package designs that enable Draper’s strategic product roadmap.

Specific Duties

• Lead concept development for advanced packages (e.g., fan out wafer level, 2.5 D/3 D interposer, system in package).
• Produce detailed layout for substrates, interposers, and die to die routing using Siemens Xpedition.
• Own package-level SI/PI strategy, including high speed digital interfaces, power delivery network (PDN) design, and decoupling strategy.
• Perform SPICE, EM, and S parameter simulations to validate SI, PDN, and crosstalk.
• Partner with mechanical engineers and analysts on die attach, under fill, molding, and thermal interface materials.
• Partner with silicon, RF, and board design engineers to co-optimize die floorplans and package interfaces.
• Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
• Author complete package build documentation, specifications, and test plans.
• Drive solutions to complex problems with limited direction - contribute to requirements development, propose paths forward, and adapt appropriately to changes in requirements.

Skills & Abilities

• Proficiency with high density substrate and packaging layout tools. Experience with Siemens Xpedition is desirable.
• Solid understanding of high-speed design signal integrity best practices.
• Experience with SI/PI analysis using Ansys SIwave and HFSS, Hyperlynx, or other industry standard tools.

Job Description: Duties/Responsibilities

Translates project and system requirements into well-defined hardware architectures working with cross-functional teams. Innovatively solves issues, drives completion of the project to schedule, and collaboratively works with other technical contributors. Builds, debugs, and tests prototypes and deliverable hardware. Prepares documentation for manufacturing, and provides continuous support. Researches and enables innovative solutions for cutting-edge designs. Engages other engineers and partners to develop reliable, cost effective end solutions for products. Drives solutions to complex problems with limited direction - contributes to requirements development, proposes ways forward, and adapts appropriately to changes in requirements. Independently performs complex electronic architectures and designs. Able to manage a task with multiple cross functional members and effectively communicates status to project leadership and customers. Actively mentors less experienced teammates and provides thoughtful, constructive feedback. Support business development and proposal activities.

Education

Bachelor's degree in electrical engineering or related field.

Experience

Advanced degree preferred. Experience 5-10 years experience in electrical engineering or related field.

Additional Job Description

Applicants selected for this position will be required to obtain and maintain a US government security clearance.

Job Location

Cambridge, Massachusetts 02139-3563

Salary

The US base salary range for this full-time position is $82,300.00 - $220,000.00 Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Union ranges will be in compliance with the collective bargaining agreement’s approved rates by location and role. Please note that the compensation details listed in US role postings reflect the base salary only, and does not include bonuses or benefits.

Benefits and Life

Draper supports many programs to improve work-life balance including workplace flexibility, employee clubs ranging from photography to yoga, health and finance workshops, off site social events and discounts to local museums and cultural activities.

Inclusion

Draper is committed to creating an inclusive environment. We understand the value of inclusivity and its impact on a high-performance culture. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, disability, age, sexual orientation, national origin, veteran status, or genetic information.

Draper is committed to providing access, equal opportunity, and reasonable accommodation for individuals with disabilities in employment, its services, programs, and activities. To request reasonable accommodation, please contact [e-mail].

Culture

We are in the business of redefining what is possible. Join our inclusive, multidisciplinary team to engineer the groundbreaking solutions of tomorrow. Explore life at Draper with our unique culture and benefits at draper.com.