Senior IC Packaging Engineer - RF/mmWave SI&PI

Blue Origin; San Diego (CA); On-site; USD 230,398 - 322,556; Full time

Benefits offered by this job

Relocation provided

Travel up to 10%

Onsite in San Diego Bay Area or Austin

Job summary

Blue Origin is seeking a Senior IC Packaging: Signal and Power Integrity Engineer within the Silicon Systems team. You will own signal and power integrity for RFIC and mmWave packaging, run HFSS simulations, and collaborate with RFIC, mmWave, ASIC, and SoC architecture teams.

This is an individual contributor role that may serve as technical lead for SI/PI of the package. Role is onsite in San Diego, CA, with relocation provided and up to 10% travel.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 7+ years of industry experience or PhD-equivalent.
• Experience delivering IC packaging in production or tangible delivery.
• Expertise with 2.5D/3D EM simulators such as HFSS, EMX, or Momentum.
• Experience with RF modeling, RF impedance, and SI/PI for high-speed routing.
• U.S. citizen or eligible status.

Responsibilities

• Own signal and power integrity for RF/Mixed-Signal and mmWave IC packaging designs.
• Perform SI analysis and HFSS simulations for high-speed signals across package interfaces.
• Design and analyze power delivery networks using HFSS to meet PI targets.
• Model and characterize RF/mmWave packaging with HFSS tools and procedures.
• Collaborate with RFIC, mmWave, ASIC, Package Layout, and SoC teams on package requirements.
• Lead the SI/PI portion of package delivery as a technical lead.
• Create documentation and support design reviews for packaging deliverables.

Skills

Signal integrity

Power integrity

RF packaging

HFSS

RF modeling

Team collaboration

Technical leadership

Education

Bachelor's degree in Electrical Engineering or related field

Tools

HFSS

EMX

Momentum

Cadence Allegro

Job description

Blue Origin is seeking a Senior IC Packaging: Signal and Power Integrity Engineer within the Silicon Systems team. You will own signal and power integrity for RFIC and mmWave packaging, run HFSS simulations, and collaborate with RFIC, mmWave, ASIC, and SoC architecture teams.

This is an individual contributor role that may serve as technical lead for SI/PI of the package. Role is onsite in San Diego, CA, with relocation provided and up to 10% travel.