Hybrid Mechanical Engineer I - Hardware & Thermal Design

Hewlett Packard Enterprise Company

Spring (TX)

Hybrid

USD 56,000 - 126,000

Full time

4 days ago

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Job summary

Hewlett Packard Enterprise Company seeks a Mechanical/Hardware Engineer I Graduate to design and analyze mechanical systems and packaging, contributing to DFMEA, tolerances, and validation testing. You will collaborate across engineering teams in a hybrid role in Texas, with learning opportunities fostering growth.

Qualifications include a ME degree, 0-2 years experience, proficiency with Pro/Engineer, and strong problem-solving and communication skills.

Qualifications

Bachelor's or Master's degree in Mechanical Engineering.
0-2 years experience typically.
Experience or understanding of ProEngineer or other 3D CAD software as a mechanical design tool.

Responsibilities

Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with provided specifications and requirements.
Implements established test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.
Develops understanding of and relationship with internal and outsourced development partners on mechanical and thermal design and development.
Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderately- complex products.