Hybrid Mechanical Engineer - Thermal & Packaging Expert

Hewlett Packard Enterprise Company; Spring (TX); Hybrid; USD 106,000 - 243,000; Full time

Job summary

Hewlett Packard Enterprise is seeking a Mechanical Engineer to contribute to the design, analysis, and validation of mechanical systems and electronics packaging. The role focuses on leading mechanical and thermal development for complex products, coordinating with internal teams and external partners.

You will guide design reviews, mentor junior engineers, and apply CFD and heat transfer principles to ensure robust solutions.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering.
• Typically 6–10 years of experience.
• Experience with mechanical/thermal architecture of electronics packaging.

Responsibilities

• Leads multiple project teams of mechanical engineers and partners across all stages of mechanical/thermal development.
• Manages relationships with internal and external development partners for design and tooling.
• Reviews designs for compliance with standards and provides actionable feedback to improve quality.
• Provides leadership and mentoring in mechanical/thermal domains across projects.
• Drives adoption of new technologies within mechanical/thermal design teams.

Skills

3D CAD Pro/Engineer

Mechanical design

Thermal management

CFD

Education

Bachelor's or Master's degree in Mechanical Engineering

Tools

Pro/Engineer

Job description

Hewlett Packard Enterprise is seeking a Mechanical Engineer to contribute to the design, analysis, and validation of mechanical systems and electronics packaging. The role focuses on leading mechanical and thermal development for complex products, coordinating with internal teams and external partners.

You will guide design reviews, mentor junior engineers, and apply CFD and heat transfer principles to ensure robust solutions.