High-Speed IC Package & SI/PI Engineer

Octopyd; Sunnyvale (CA); On-site; USD 120,000 - 150,000; Full time

Job summary

Avicena in Sunnyvale is seeking a package integration and SI/PI engineer to own the boundary between our ASIC and its package. You will ensure high-speed signals, clocks and power reach the chip cleanly, and that package constraints are reflected in the chip design early.

You will define die-package interfaces, perform signal and power integrity analyses across die, package and board, build models, run co-simulations, and collaborate with the core chip and package teams.

Qualifications

• MS in Electrical Engineering or BS with equivalent experience
• 5+ years of SI/PI work on high-speed ICs and packages
• Experience with HFSS, SIwave, RedHawk, Sigrity/Clarity or ADS

Responsibilities

• Own the die-package boundary for the ASIC and define signal/power assignments with the package team.
• Perform signal integrity analysis across die, package and board.
• Perform power integrity analysis from die through package to board.
• Build and exchange chip power and package models; run die-package co-simulation.
• Provide power maps for thermal analysis.
• Define ESD and supply strategy with core teams.
• Run die/package feasibility reviews and compare models with lab measurements.

Skills

SI/PI

High-speed ICs

Package design

Power integrity

Co-simulation

Education

MS in Electrical Engineering

Tools

Ansys HFSS

SIwave

RedHawk

Cadence Sigrity

Clarity

Keysight ADS

Job description

Avicena in Sunnyvale is seeking a package integration and SI/PI engineer to own the boundary between our ASIC and its package. You will ensure high-speed signals, clocks and power reach the chip cleanly, and that package constraints are reflected in the chip design early.

You will define die-package interfaces, perform signal and power integrity analyses across die, package and board, build models, run co-simulations, and collaborate with the core chip and package teams.