Package Integration and SI/PI Engineer

Avicena; Sunnyvale (CA); On-site; USD 120,000 - 150,000; Full time

Job summary

Avicena in Sunnyvale is seeking a package integration and SI/PI engineer to own the boundary between our ASIC and its package. You will ensure high-speed signals, clocks and power reach the chip cleanly, and that package constraints are reflected in the chip design early.

You will define die-package interfaces, perform signal and power integrity analyses across die, package and board, build models, run co-simulations, and collaborate with the core chip and package teams.

Qualifications

• MS in Electrical Engineering or BS with equivalent experience
• 5+ years of SI/PI work on high-speed ICs and packages
• Experience with HFSS, SIwave, RedHawk, Sigrity/Clarity or ADS

Responsibilities

• Own the die-package boundary for the ASIC and define signal/power assignments with the package team.
• Perform signal integrity analysis across die, package and board.
• Perform power integrity analysis from die through package to board.
• Build and exchange chip power and package models; run die-package co-simulation.
• Provide power maps for thermal analysis.
• Define ESD and supply strategy with core teams.
• Run die/package feasibility reviews and compare models with lab measurements.

Skills

SI/PI

High-speed ICs

Package design

Power integrity

Co-simulation

Education

MS in Electrical Engineering

Tools

Ansys HFSS

SIwave

RedHawk

Cadence Sigrity

Clarity

Keysight ADS

Job description

Avicena is developing high-speed parallel optical links built from arrays of microLED transmitters and photodetector receivers. We are looking for a package integration and SI/PI engineer to own the boundary between our ASIC and its package. You will make sure high-speed signals, clocks and power reach the chip cleanly, and that package constraints are reflected in the chip design early.

Key Responsibilities

• Own the die-package boundary for the ASIC: bump and pad map inputs, and signal and power assignment with the package team.
• Perform signal integrity analysis of high-speed and clock paths across die, package and board: channel extraction, crosstalk and return paths.
• Perform power integrity analysis from die through package to board: impedance targets, supply noise and ripple, and on-die and package decoupling.
• Build and exchange chip power and package models, and run die-package co-simulation with the chip team.
• Provide power maps for thermal analysis.
• Define ESD and supply strategy with the core analog and layout teams.
• Run die/package feasibility reviews and correlate models with lab measurements.

Qualifications

Required

• MS in Electrical Engineering (or BS with equivalent experience) and 5+ years of SI/PI work on high-speed ICs and packages.
• Experience with tools such as Ansys HFSS, SIwave and RedHawk, Cadence Sigrity and Clarity, or Keysight ADS.
• Strong grasp of S-parameters, TDR, transmission lines and PDN design.

Preferred

• 2.5D/3D or other advanced packaging.
• Optical or co-packaged optics modules.
• Lab measurement with VNA and oscilloscopes.
• Python or MATLAB automation.
• Systems view: thinks across die, package and board.
• Analytical: grounds decisions in models and measurements.
• Collaboration: bridges chip and package teams.
• Clear communicator: turns analysis into concrete constraints.