HBM Test & Characterization Intern

Micron Technology; Richardson (TX); On-site; USD 110,000 - 140,000; Full time

Job summary

Micron Technology is seeking an experienced characterization engineer to advance High Bandwidth Memory (HBM) technologies in Richardson, Texas. You will design bench-level tests, run thermal and electrical stress experiments, and develop test software to enable rapid root-cause investigations.

In this role you will analyze complex data sets, correlate test results with device behavior, and collaborate across DTPCO, Product Engineering, and Reliability teams to drive product quality and yield

Qualifications

• Bachelor’s degree in Electrical Engineering or related field.
• 3+ years in semiconductor characterization or failure analysis.
• Hands-on with oscilloscopes, SMUs, power supplies, and prober/test hardware.
• Proficient in Python and either Verilog or C/C++.

Responsibilities

• Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows.
• Perform thermal, mechanical, and electrical characterization of HBM cubes under various conditions.
• Develop Python-, Verilog-, and C/C++-based test programs and workloads.
• Analyze MBIST signatures and complex datasets to identify root causes.
• Leverage AI tools to improve engineering workflows and data analysis.

Skills

Python

Data analysis

Root-cause

Education

B.S. EE

M.S. preferred

Tools

Oscilloscopes

SMUs

Verilog

Python

C/C++

Job description

Micron Technology is seeking an experienced characterization engineer to advance High Bandwidth Memory (HBM) technologies in Richardson, Texas. You will design bench-level tests, run thermal and electrical stress experiments, and develop test software to enable rapid root-cause investigations.

In this role you will analyze complex data sets, correlate test results with device behavior, and collaborate across DTPCO, Product Engineering, and Reliability teams to drive product quality and yield