HBM Characterization Intern: Test, Debug & Analyze

Micron; Richardson (TX); On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off and holidays

Job summary

Micron Technology seeks a skilled engineer to advance high-bandwidth memory (HBM) characterization through bench-level test setups and data analysis. You will develop Python-, Verilog-, and C/C++-based test programs, perform thermal and electrical characterization, and investigate root causes across design, process, and packaging.

The role emphasizes using AI-enabled tools to streamline workflows, with a focus on reliability, performance, and yield across future HBM generations.

Qualifications

• Bachelor’s degree in a technical field (EE/CE/Materials/Physics) and 3+ years in semiconductor characterization or related fields.
• Hands-on with lab equipment: oscilloscopes, SMUs, power supplies, thermal systems, probe stations, automated test hardware.
• Proficient in Python and at least one of C/C++ or Verilog; able to analyze datasets and perform root-cause investigations.

Responsibilities

• Design, build, debug, and maintain custom bench-level test setups and measurement flows.
• Perform thermal, mechanical, and electrical characterization of HBM cubes under various conditions.
• Develop Python-, Verilog-, and C/C++-based test programs and workloads for characterization.
• Analyze MBIST signatures and datasets to identify root causes and recommend fixes.
• Leverage AI/Generative AI tools to improve engineering workflows and data analysis.

Skills

Python programming

C/C++

Verilog

Statistical methods

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics

Master's or PhD in Electrical Engineering, Computer Engineering, Materials Science, Physics

Tools

Oscilloscopes

SMUs

Power supplies

Thermal systems

Probe stations

Automated test hardware

Job description

Micron Technology seeks a skilled engineer to advance high-bandwidth memory (HBM) characterization through bench-level test setups and data analysis. You will develop Python-, Verilog-, and C/C++-based test programs, perform thermal and electrical characterization, and investigate root causes across design, process, and packaging.

The role emphasizes using AI-enabled tools to streamline workflows, with a focus on reliability, performance, and yield across future HBM generations.