HBM Characterization Engineer Intern

Micron Technology, Inc.; Richardson, Northern (TX, KY); Hybrid; USD 65,000 - 90,000; Full time

Benefits offered by this job

Medical benefits

Dental benefits

Vision benefits

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking an Intern - Engineer for the HIG HBM DTPCO group in Richardson, Texas. The role focuses on bench-level characterization of HBM cubes under thermal, mechanical, and electrical stress to improve performance, yield and reliability.

You will develop test programs in Python, Verilog, and C/C++, and analyze data to drive root-cause investigations. Join a collaborative team working with Design Technology Co-Optimization, Product Engineering, Packaging and Reliability

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field.
• 3+ years of experience in semiconductor characterization, failure analysis, product engineering, test engineering, or a related field.

Responsibilities

• Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment.
• Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold and transient conditions, including power-temperature correlation and failure-onset analysis.
• Develop and maintain Python-, Verilog-, and C/C++-based test programs and workloads to accelerate root-cause investigations.
• Analyze MBIST signatures and datasets to identify root causes and recommend corrective actions.
• Leverage AI/Generative AI tools to improve engineering workflows and data analysis.

Skills

Python

Verilog

C/C++

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science or Physics

Tools

Oscilloscopes

SMUs

Power supplies

Thermal systems

Probe stations

Job description

Micron Technology, Inc. is seeking an Intern - Engineer for the HIG HBM DTPCO group in Richardson, Texas. The role focuses on bench-level characterization of HBM cubes under thermal, mechanical, and electrical stress to improve performance, yield and reliability.

You will develop test programs in Python, Verilog, and C/C++, and analyze data to drive root-cause investigations. Join a collaborative team working with Design Technology Co-Optimization, Product Engineering, Packaging and Reliability