HBM SoC Physical Design Intern — AI/HPC Impact

Micron Technology; Folsom (CA); On-site; USD 81,000 - 104,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology is seeking a highly motivated SoC Physical Design Intern to join the HBM team. You will work with experienced engineers on implementing advanced HBM SoC designs and gain hands-on experience in physical design methodologies, timing analysis, and signoff flows.

You will contribute to automation, scripting, and tooling using Python, Tcl, and shell scripting while collaborating with cross-functional teams to document results and present findings.

Qualifications

• Currently pursuing a Master's degree in Electrical Engineering, Computer Engineering, or related technical field.
• Knowledge of ASIC design flow concepts, including synthesis, place-and-route, static timing analysis, and physical verification.
• Experience with programming or scripting languages such as Python, Tcl, Perl, and/or Shell.
• Familiarity with AI-enabled tools and large language models (LLMs).

Responsibilities

• Support the physical implementation of SoC design blocks, including floorplanning, placement, clock tree synthesis, routing, and physical optimization activities.
• Analyze timing, power, area, congestion, and physical verification results to find opportunities for design improvement and optimization.
• Assist with static timing analysis, timing closure, and debugging across multiple operating modes and process corners.
• Develop and enhance automation tools, scripts, reports, and workflows using Python, Tcl, shell scripting, and AI-assisted solutions.
• Collaborate with multi-functional engineering teams to document results, participate in design reviews, and present technical findings.

Skills

ASIC design flow

Synthesis

Place-and-route

Static timing analysis

Physical verification

Python scripting

Tcl scripting

Shell scripting

Problem-solving

Teamwork

AI/tool familiarity

Education

Master's degree in Electrical Engineering or Computer Engineering

Tools

Cadence Innovus/Tempus

Synopsys ICC2/PrimeTime

Siemens Calibre

Job description

Micron Technology is seeking a highly motivated SoC Physical Design Intern to join the HBM team. You will work with experienced engineers on implementing advanced HBM SoC designs and gain hands-on experience in physical design methodologies, timing analysis, and signoff flows.

You will contribute to automation, scripting, and tooling using Python, Tcl, and shell scripting while collaborating with cross-functional teams to document results and present findings.