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Micron Technology, Inc. in Boise, Idaho, is seeking a Product Pathfinding Engineer for the High Bandwidth Memory (HBM) team. You will help develop JEDEC-HBM or alternative DRAM solutions, including 2.5D/3D integration, from electrical and packaging perspectives.
You will collaborate with Research, Manufacturing, Marketing, and Quality Assurance to define requirements, ensure test coverage, and deliver robust products with low power per bit for ML/AI workloads.
Micron Technology, Inc. in Boise, Idaho, is seeking a Product Pathfinding Engineer for the High Bandwidth Memory (HBM) team. You will help develop JEDEC-HBM or alternative DRAM solutions, including 2.5D/3D integration, from electrical and packaging perspectives.
You will collaborate with Research, Manufacturing, Marketing, and Quality Assurance to define requirements, ensure test coverage, and deliver robust products with low power per bit for ML/AI workloads.