HBM Product Pathfinding Engineer

Micron Technology, Inc.

Boise (ID)

Sur place

USD 110 000 - 160 000

Plein temps

Il y a 5 jours
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Résumé du poste

Micron Technology, Inc. in Boise, Idaho, is seeking a Product Pathfinding Engineer for the High Bandwidth Memory (HBM) team. You will help develop JEDEC-HBM or alternative DRAM solutions, including 2.5D/3D integration, from electrical and packaging perspectives.

You will collaborate with Research, Manufacturing, Marketing, and Quality Assurance to define requirements, ensure test coverage, and deliver robust products with low power per bit for ML/AI workloads.

Qualifications

  • Strong foundation in Electrical or Computer Engineering.
  • Experience with high-speed datapath design and circuit analysis.
  • Ability to collaborate across multiple teams to meet product goals.

Responsabilités

  • Initiate collaborations with customers, TD, Test, and Manufacturing to capture requirements for next-gen products.
  • Work with System Engineering, Component Validation, and Media Health to plan responses to tech node changes.
  • Ensure silicon findings are resolved within timelines and maintain test coverage for Alpha products.
  • Forge alliances with Build, Verification, Product Architecture, System Compatibility Group, and Silicon Strategy teams.
  • Identify and drive build-readiness improvement initiatives and align with product leadership strategy.

Connaissances

Electrical Engineering
High-speed datapath
Circuit analysis
Analytical problem solving
Cross-functional collaboration

Formation

Bachelor's degree in Electrical/Computer Engineering

Description du poste

Micron Technology, Inc. in Boise, Idaho, is seeking a Product Pathfinding Engineer for the High Bandwidth Memory (HBM) team. You will help develop JEDEC-HBM or alternative DRAM solutions, including 2.5D/3D integration, from electrical and packaging perspectives.

You will collaborate with Research, Manufacturing, Marketing, and Quality Assurance to define requirements, ensure test coverage, and deliver robust products with low power per bit for ML/AI workloads.

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