HBM Systems Engineer Intern for AI & HPC

Micron Technology, Inc.; Boise (ID); On-site; USD 25,000 - 39,000; Full time

Benefits offered by this job

Medical/dental/vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Boise, Idaho seeks an High Bandwidth Memory (HBM) Product & System Engineering Intern to help validate HBM in customer platforms. You will work with experienced engineers to develop testing methods and integrate HBM into systems, advancing AI and HPC capabilities.

You will gain hands-on experience with hardware/software validation, lab characterization, and cross-functional collaboration in a fast-paced semiconductor environment.

Qualifications

• Pursuing or completed Bachelor's or Master's in Electrical or Computer Engineering.
• Strong understanding of computer architecture and memory systems.
• Proficiency in Python, C/C++, and scripting for testing and debugging.
• Excellent problem-solving and collaboration skills.
• Effective communication and proactive teamwork.

Responsibilities

• Develop and improve software and hardware to validate HBM in various systems.
• Configure, maintain, and characterize HBM-based systems in a lab environment.
• Assist in debugging complex technical challenges across hardware and software.
• Communicate results and insights to teammates and leadership.
• Learn and apply knowledge of HBM, DRAM, and memory systems.

Skills

Python

C/C++

Scripting

Education

Bachelor’s or Master’s degree in Electrical or Computer Engineering

Tools

Verilog/SystemVerilog

Job description

Micron Technology, Inc. in Boise, Idaho seeks an High Bandwidth Memory (HBM) Product & System Engineering Intern to help validate HBM in customer platforms. You will work with experienced engineers to develop testing methods and integrate HBM into systems, advancing AI and HPC capabilities.

You will gain hands-on experience with hardware/software validation, lab characterization, and cross-functional collaboration in a fast-paced semiconductor environment.