HBM Product Pathfinding Engineer

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking a Product Pathfinding Engineer to drive development of HBM and related near-memory DRAM solutions, including 2.5D/3D packaging from electrical and packaging perspectives.

You will collaborate with R&D, Manufacturing, Marketing and Quality Assurance to capture requirements, plan test coverage, and deliver next-generation products on schedule. Strong electrical engineering background required.

Qualifications

• Strong foundation in Electrical or Computer Engineering with proven industry experience in high-speed datapath design, logic development, and advanced circuit analysis.
• Demonstrated ability to solve complex technical challenges using exceptional analytical, debugging, and problem-solving skills.
• Consistent track record of delivering high-quality results and driving excellence in current and previous areas of responsibility.
• Proven success collaborating across multi-functional teams to solve complex problems and achieve shared business objectives.
• Excellent communication, presentation, and interpersonal skills, with the ability to influence partners and thrive in a highly collaborative environment.

Responsibilities

• Initiate collaborations with customers, TD, Test, and Manufacturing to capture key requirements and findings to ensure the success of next-generation product development.
• Work closely with other PE groups like System Engineering, Component Validation, and Media Health teams. Together, plan responses to future technology node changes. Ensure adequate test coverage for the upcoming Alpha product.
• Ensure all silicon findings are resolved in line with the encouraged timelines for issue closure for the designs your team is handling.
• Forge strong alliances with Build, Verification, Product Architecture, System Compatibility Group, and Silicon Strategy teams to deliver products in an effective and efficient manner.
• Identify and orchestrate ongoing improvement initiatives in the realm of build readiness to ensure swift implementation of learned lessons.
• Work closely with the Product Leadership Team to ensure build readiness is fully included in the overall product leadership strategy. Ensure these strategies align with product objectives and timelines.

Skills

Electrical/Computer Eng

High-speed datapath design

Logic development

Circuit analysis

Analytical/problem-solving

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking a Product Pathfinding Engineer to drive development of HBM and related near-memory DRAM solutions, including 2.5D/3D packaging from electrical and packaging perspectives.

You will collaborate with R&D, Manufacturing, Marketing and Quality Assurance to capture requirements, plan test coverage, and deliver next-generation products on schedule. Strong electrical engineering background required.