HBM Technology Pathfinding Engineer

Micron Technology, Inc.; Boise (ID); On-site; USD 110,000 - 160,000; Full time

Job summary

Micron Technology, Inc. is seeking a Product Pathfinding Engineer for the High Bandwidth Memory (HBM) team in Boise, Idaho. This role focuses on development of JEDEC-HBM and 2.5D/3D solutions, interfacing with R&D, Manufacturing, Marketing and QA to drive next‑generation memory products.

You will collaborate with multiple PE groups, plan for future technology node changes, ensure thorough test coverage, and drive timely issue resolution while optimizing power per bit for ML/AI workloads.

Qualifications

• Strong foundation in Electrical or Computer Engineering with proven industry experience in high-speed datapath design.
• Analytical, debugging, and problem-solving skills to tackle complex challenges.
• Proven track record delivering high-quality results and collaborating across teams.
• Excellent communication and interpersonal skills to influence partners in a collaborative environment.

Responsibilities

• Initiate collaborations with customers, TD, Test, and Manufacturing to capture requirements.
• Coordinate with System Engineering, Component Validation, and Media Health teams for future tech changes.
• Ensure silicon findings are resolved within timelines for the designs your team handles.
• Forge alliances with Build, Verification, Product Architecture, System Compatibility and Silicon Strategy teams.
• Identify ongoing build-readiness improvements and ensure lessons are implemented swiftly.
• Work with Product Leadership to align build readiness with product objectives and timelines.

Skills

Electrical or Computer Engineering

High-speed datapath design

Logic development

Advanced circuit analysis

Analytical/problem-solving

Cross-functional collaboration

Excellent communication

Job description

Micron Technology, Inc. is seeking a Product Pathfinding Engineer for the High Bandwidth Memory (HBM) team in Boise, Idaho. This role focuses on development of JEDEC-HBM and 2.5D/3D solutions, interfacing with R&D, Manufacturing, Marketing and QA to drive next‑generation memory products.

You will collaborate with multiple PE groups, plan for future technology node changes, ensure thorough test coverage, and drive timely issue resolution while optimizing power per bit for ML/AI workloads.