3D Heterogeneous Integration Engineer (Quantum Packaging)

Socket.dev; Virginia (MN); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries seeks a motivated New College Graduate to join the Quantum Advanced Packaging team as a bonding integration engineer focused on 3D heterogeneous integration, including wafer-to-wafer and die-to-wafer bonding.

The program offers accelerated training, mentorship, cross-functional opportunities, and networking to build leadership skills in a fast-paced environment with OSAT collaboration and process engineering exposure.

Qualifications

• Education – Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• Prior related internship or co-op experience.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 10%.

Responsibilities

• Drive 3DHI process development with unit process engineers and suppliers.
• Collaborate with OSATs to develop wafer/die level 2.5D and 3D integration processes.
• Develop expertise in processes, materials and tooling using characterization resources.
• Drive mechanistic understanding of failure modes.
• Develop integration schemes to improve yields and reduce cycle time and costs.
• Generate IP related to wafer integration and packaging tech.
• Work with other teams on various assignments as needed.

Skills

English proficiency

Leadership

Project management

Communication

Planning & organization

Education

Bachelor’s or Master’s in Electrical, Mechanical, Chemical, Materials Science or related field

Job description

GlobalFoundries seeks a motivated New College Graduate to join the Quantum Advanced Packaging team as a bonding integration engineer focused on 3D heterogeneous integration, including wafer-to-wafer and die-to-wafer bonding.

The program offers accelerated training, mentorship, cross-functional opportunities, and networking to build leadership skills in a fast-paced environment with OSAT collaboration and process engineering exposure.