Quantum NCG 3DHI Engineer

GlobalFoundries inc.; New York, Northern (NY, KY); Hybrid; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a motivated R&D bonding integration engineer to join the Quantum Advanced Packaging team in New York. The role focuses on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding.

You will drive 3DHI process development with unit process engineers and suppliers, collaborate with OSATs on 2.5D/3D schemes, improve yields, reduce cycle time and cost, and generate IP for novel wafer integration.

Qualifications

• Experience coordinating cross-functional teams and projects.
• Strong analytical and problem-solving abilities.
• Excellent written and verbal communication in English.

Responsibilities

• Drive 3DHI process development with unit process engineers and suppliers.
• Collaborate with OSATs to develop 2.5D and 3D heterogeneous integration processes.
• Develop expertise in materials, processes, and tooling; leverage characterization resources.
• Identify failure modes and drive mechanistic understanding to improve yields.
• Generate IP related to wafer integration and packaging technology.

Skills

Project management

Leadership

Technical communication

English proficiency

Education

Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related

Job description

**About GlobalFoundries:**GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.**New College Graduate Overview:**We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.**Summary of Role:**GlobalFoundries is seeking a motivated R&D bonding integration engineer to become part of our Quantum Advanced Packaging team. This role will entail 3D heterogeneous integration (3DHI) development including wafer-to-wafer and die-to-wafer bonding.**Essential Responsibilities:*** Drive 3DHI process development efforts and planning by working with the unit process engineers and directly with the tools & materials suppliers for the Quantum Advanced Packaging projects.* Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes.* Develop expertise in the processes, materials and tooling leveraging available characterization resources.* Drive a mechanistic understanding of failure modes.* Develop integration schemes to continuously improve yields and to reduce cycle time & costs.* Generate IP related to novel wafer integration & packaging technology.* Work and collaborate with other teams regarding different assignments as needed.**Other Responsibilities:*** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.* Other duties as assigned by manager.**Required Qualifications:*** Education – Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.* Prior related internship or co-op experience.* Must have at least an overall 3.0 GPA and proven good academic standing.* Language Fluency - English (Written & Verbal).* Travel - Up to 10%.**Preferred Qualifications:*** PhD education level preferred.* Fundamental knowledge of semiconductor packaging process modules and integration.* Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.* Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.* Strong written and verbal communication skills.* Strong planning and organizational skills.#NCGProgramUS**Expected Salary Range**$85,000.00 - $146,000.00The exact Salary will be determined based on qualifications, experience and location.