End-to-End Silicon Packaging Architect

Intel Corporation; Chandler (AZ); On-site; USD 164,000 - 312,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation is seeking a senior Silicon Packaging Design Architect to lead end-to-end package solutions for physical, electrical, and cost requirements in the United States. You will drive design-to-production transitions and partner with cross-functional teams to push Intel's advanced packaging technologies.

The role emphasizes collaboration with silicon, hardware, and package teams, tradeoff decisions to meet standards, and ongoing process improvements to quality and cost targets.

Qualifications

• Bachelor’s, Master’s or PhD in EE or STEM-related field with relevant experience.
• Extensive background in silicon packaging, PCB design or IC digital design is required.
• Experience with electromagnetic simulation tools and packaging processes.

Responsibilities

• Translate product requirements into package architecture specifications.
• Drive tradeoff decisions to meet electrical, mechanical, thermal, and reliability standards.
• Collaborate with silicon, hardware and package teams to deliver high-quality package solutions.
• Oversee end-to-end package development and continuous quality improvements.
• Troubleshoot packaging designs and resolve material/process issues cost-effectively.
• Implement co-design strategies between silicon and board design teams.
• Collaborate with EDA partners to advance design tools and methods.

Skills

EM simulation

Cadence tools

Mentor Xpedition

PCB design

Troubleshooting

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical Engineering

PhD in Electrical Engineering

Tools

Cadence Allegro

Mentor Graphics

Sigrity

APD/SiP tools

Hyperlynx

ANSYS

Job description

Intel Corporation is seeking a senior Silicon Packaging Design Architect to lead end-to-end package solutions for physical, electrical, and cost requirements in the United States. You will drive design-to-production transitions and partner with cross-functional teams to push Intel's advanced packaging technologies.

The role emphasizes collaboration with silicon, hardware, and package teams, tradeoff decisions to meet standards, and ongoing process improvements to quality and cost targets.