Lead, Advanced Packaging & Chiplet Integration

Intel Corporation; Chandler (AZ); Hybrid; USD 221,000 - 312,000; Full time

Benefits offered by this job

Health benefits

Stock bonuses

Hybrid work model

Job summary

Intel Corporation in the United States (Arizona, Phoenix) seeks a Semiconductor Packaging Integration Research Manager to lead advanced packaging integration research for next-generation heterogeneous tech. You will guide architecture, chiplet assembly, substrate/interposer tech, and reliability across teams.

You will define research strategy, manage a multidisciplinary team, and drive feasibility, prototyping, and readiness assessments, partnering with design, process, materials, and

Qualifications

• Demonstrated experience leading advanced technology research programs and multidisciplinary teams.
• Ability to convert ambiguous challenges into hypotheses, experiments, milestones, and actionable plans.
• Strong understanding of package-system integration, chiplet architectures, interconnects, and reliability trade-offs.

Responsibilities

• Lead packaging integration research programs focusing on heterogeneous integration and 2.5D/3DIC concepts.
• Define strategy, roadmaps, milestones, and decision criteria for future product scaling.
• Manage a multidisciplinary team across packaging, modeling, design, and manufacturing.
• Translate system requirements into package solutions balancing performance, power, area, and cost.
• Collaborate with device, process, substrate, test, reliability, and manufacturing teams.
• Drive Feasibility studies, experiments, and readiness assessments for early-stage packaging options.
• Guide technology transfer, risk reviews, and scaling paths to development.

Skills

Leadership

Packaging integration

Chiplet architectures

Heterogeneous integration

Cross-functional collaboration

Technology roadmaps

Modeling/simulation

Data-driven learning

External ecosystem collaboration

Strategic communication

Education

Master’s degree in engineering or related field

Job description

Intel Corporation in the United States (Arizona, Phoenix) seeks a Semiconductor Packaging Integration Research Manager to lead advanced packaging integration research for next-generation heterogeneous tech. You will guide architecture, chiplet assembly, substrate/interposer tech, and reliability across teams.

You will define research strategy, manage a multidisciplinary team, and drive feasibility, prototyping, and readiness assessments, partnering with design, process, materials, and