EMIB-T Substrate Yield Lead: Drive Manufacturing Readiness

Intel; Phoenix (AZ); On-site; USD 181,000 - 255,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Vacation

Job summary

Intel's APTM organization seeks an EMIB-T Substrate Yield Lead to own yield performance for next-generation EMIB-T packaging, guiding cross-functional teams across development and manufacturing readiness for IFS and IPG programs. This role demands deep technical expertise, urgency, and the ability to drive issues to closure on a fast-paced, high-visibility program.

The candidate will lead yield optimization, DFx engagement, and risk mitigation, while scaling yield intelligence infrastructure and

Qualifications

• Masters degree with 6+ years in Engineering, Materials Science, Physics, Chemistry, Data Science, or related field.
• 5+ years in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, or related field.
• Hands-on experience in substrate, advanced packaging, or semiconductor yield engineering, incl. statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and HVM execution.
• Strong analytical and problem-solving skills with the ability to make data-driven decisions in complex environments.
• Experience working across multiple organizations and influencing stakeholders to achieve results.
• Demonstrated ability to independently manage complex technical issues, execute with urgency, and drive actions to closure.
• Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML-based defect detection, or automated defect classification systems.

Responsibilities

• Own end-to-end substrate yield performance for EMIB-T technology development and manufacturing readiness.
• Drive DFM/DFY engagement, defect pareto closure, process optimization, and yield improvement plans from signal identification through execution.
• Lead daily yield huddles and cross-functional reviews to ensure program execution remains on track and yield risks are identified and addressed with urgency.
• Proactively identify, prioritize, and drive closure of critical yield, reliability, process, and supplier-related issues with minimal management oversight.
• Partner closely with substrate suppliers, substrate module engineers, substrate integration, manufacturing teams, design teams, Q&R organizations, and platform integration to achieve technology and business milestones.
• Establish clear accountability, track actions, challenge roadblocks, and ensure commitments are delivered on schedule.
• Drive yield readiness assessments, risk mitigation plans, and executive communications for program reviews.
• Define and scale the yield intelligence infrastructure needed for EMIB-T, including dashboards, automated analytics, computer vision, AI/ML defect detection, and automated defect classification.
• Enable successful EMIB-T deployment and scaling across multiple products and business groups, supporting both IFS and IPG programs.

Skills

Analytical skills

Cross-functional collaboration

Problem solving

Data-driven decisions

Yield engineering

Education

Masters degree with 6+ years experience

PhD with 4+ years experience

Tools

Statistical analysis

DFM/DFY

Failure analysis

Job description

Intel's APTM organization seeks an EMIB-T Substrate Yield Lead to own yield performance for next-generation EMIB-T packaging, guiding cross-functional teams across development and manufacturing readiness for IFS and IPG programs. This role demands deep technical expertise, urgency, and the ability to drive issues to closure on a fast-paced, high-visibility program.

The candidate will lead yield optimization, DFx engagement, and risk mitigation, while scaling yield intelligence infrastructure and