EMIB-T Substrate Program Integrator

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 89,000 - 171,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Phoenix, AZ seeks a senior engineer to lead EMIB‑T substrate technology development and qualification, ensuring readiness across suppliers and platforms. You will drive technical enablement and coordinate milestones, working closely with cross‑functional engineering teams and partners to deliver advanced packaging solutions.

The role emphasizes performance in high‑volume manufacturing, supplier management, and leadership in global teams, with on‑site work in the United

Qualifications

• Bachelor's degree with 6+ years of experience or higher degrees with required experience.
• Experience managing complex projects in TD/high-volume manufacturing environments.
• Strong foundation in advanced packaging, substrates, or semiconductor manufacturing.
• Experience with supplier management or technology enablement.

Responsibilities

• Lead EMIB‑T substrate technology development and qualification activities.
• Drive technical enablement and manage readiness milestones.
• Collaborate with cross-functional engineering teams, suppliers, and assembly platform partners.

Skills

Project management

Education

Bachelor's degree in a related technical field

Master's degree in a related technical field

PhD in a related technical field

Tools

Characterization techniques: X-ray, SEM, FTIR, EDX

Job description

Job Details

The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling advanced packaging technology developments. In this position, you will lead EMIB‑T substrate technology development and qualification activities, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams, suppliers, and assembly platform partners.

Qualifications

• Minimum Qualifications: Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field. Experience listed above should be in the following: Experience managing complex projects and deliver results in TD/high-volume manufacturing environments.

Preferred Qualifications

• A strong foundation in advanced packaging, substrates, or semiconductor manufacturing; proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams.
• Proven ability to thrive in high-ambiguity environments and deliver results under pressure.
• Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.
• Familiarity with characterization techniques such as X-ray, SEM, FTIR, and EDX.
• Experience with process flow development, FMEA, DOE design, and problem-solving tools.
• Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

Annual Salary Range

• Annual Salary Range for jobs which could be performed in the US: $89,010.00-170,630.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Work Model for this Role

• This role will require an on-site presence.
• Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION

• Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices.
• We do not charge any fees during our hiring process.
• Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
• If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
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Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A

Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.