Global Supplier Enablement Lead – Advanced Packaging

Intel Corporation; Chandler (AZ); On-site; USD 164,000 - 232,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Paid vacation

Job summary

Intel Corporation's Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization seeks a leader to drive supplier development and qualification for high-density FCBGA, EMIB-T, and glass core substrates.

You will coordinate with cross-functional engineering teams and supplier partners, manage readiness milestones, and apply data-driven problem solving to enable reliable manufacturing and continuous improvement across high-volume production environments.

Qualifications

• Bachelor's degree plus 9+ years of relevant experience OR Master's with 6+ years OR PhD with 4+ years.
• Experience with process integration methodologies and tools in semiconductor manufacturing.
• Experience in advanced packaging, substrates, or semiconductor process development.

Responsibilities

• Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
• Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
• Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
• Drive continuous improvement initiatives to minimize defects and optimize process reliability.
• Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
• Collaborate with internal teams and external stakeholders to align process strategies with program goals.

Skills

Structured problem solving

Data-driven decision making

Supplier management

Cross-functional collaboration

Communication skills

Education

Bachelor's degree in engineering/physics/materials science or related

Master's degree in engineering/physics/materials science or related

PhD in engineering/physics/materials science or related

Tools

Process integration tools

Advanced packaging tools

Job description

Intel Corporation's Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization seeks a leader to drive supplier development and qualification for high-density FCBGA, EMIB-T, and glass core substrates.

You will coordinate with cross-functional engineering teams and supplier partners, manage readiness milestones, and apply data-driven problem solving to enable reliable manufacturing and continuous improvement across high-volume production environments.