Electro Mechanical Engineer Sr Stf

Lockheed Martin; Orlando (FL); On-site; USD 129,000 - 240,000; Full time

Benefits offered by this job

Medical coverage

Dental

Vision

Flexible schedules (4x10)

401(k) match

Paid time off

Parental Leave

Education assistance

Life Insurance

Short‑Term Disability

Long‑Term Disability

Job summary

Lockheed Martin in Orlando is seeking an Electro‑Mechanical Design Engineer for the Advanced Electronics Packaging team. You will design, prototype, and test cutting‑edge packaging solutions, collaborating with electrical, systems, test, and product design engineers.

You will mentor junior engineers and contribute to risk assessments while staying current with emerging semiconductor packaging technologies. Orlando location with a strong focus on flight‑qualified hardware.

Qualifications

• BS in EE/ME or related STEM field from an accredited university.
• Minimum 10 years of professional experience in electromechanical engineering with a relevant degree.
• Alternatively, 15+ years of electromechanical experience without a degree.

Responsibilities

• Conceive and model 2D/3D heterogeneous package architectures.
• Develop mechanical/electrical designs for thin-film interconnects and thermal features.
• Create test plans and validate electrical, thermal, and mechanical performance.
• Document designs with drawings, BOMs, specs, and verification reports.

Skills

Microelectronics & Layout Design

Interconnect Engineering

High-Speed Systems

Requirements Management

Component Selection

Education

BS in Electrical/Mechanical Eng or related STEM

Tools

MBSE

CAMEO

Job description

Electro‑Mechanical Design Engineer

You will be the Electro‑Mechanical Design Engineer for the Advanced Electronics Packaging team. Our team pioneers 2‑D/3‑D heterogeneous packaging concepts, blending thin‑film, semiconductor, and high‑performance thermal‑management technologies to deliver next‑generation electronic systems for aerospace and defense missions.

What You Will Be Doing

As the Electro‑Mechanical Design Engineer you will design, prototype, and test cutting‑edge packaging solutions while partnering with electrical, systems, test, and product‑design engineers. You’ll work side‑by‑side with LockheedMartin’s senior Advanced Packaging SME, gaining hands‑on experience with emerging semiconductor processes and turning them into flight‑qualified hardware.

Your responsibilities will include:

• Conceiving and modeling 2‑D/3‑D heterogeneous package architectures that meet size, weight, power, and reliability targets.
• Developing detailed mechanical and electrical designs for thin‑film interconnects, semiconductor dies, and advanced thermal‑management features.
• Creating and executing test plans to validate electrical performance, thermal behavior, and mechanical integrity of prototypes.
• Performing failure analysis and iterating designs based on test data, simulations, and manufacturing feedback.
• Preparing comprehensive design documentation—including drawings, BOMs, specifications, and verification reports.
• Collaborating with cross‑functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME with knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology‑readiness reviews and contributing to risk‑assessment activities for new packaging concepts.
• Traveling as needed to support supplier visits, test campaigns, and program milestones.

Why Join Us

Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security. Learn more about Lockheed Martin’s comprehensive benefits package here.

Further Information About This Opportunity

This position is in Orlando.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.

Basic Qualifications

• Minimum 10 years of professional experience in Electromechanical Engineering or related discipline with a Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university

or Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree

• Microelectronics & Layout Design: Proven experience in microelectronics design, including Circuit Card Assembly (CCA) / Printed Wiring Board (PWB/PCB) design, and flex circuit design.
• Interconnect Engineering: Experience with cable harness concepts for subsystem interfaces and generating detailed functional wiring diagrams.
• High-Speed Systems: Familiarity with high-speed applications and associated PWB layout constraints.
• Requirements Management: Experience capturing, flowing down, and deriving technical requirements for complex electromechanical designs.
• Component Selection: Experience managing parts, materials, and process selections for electronic hardware

Desired Skills

• Advanced Packaging Architecture: Experience with System-on-Chip (SOC) / Multi-Chip Package (MCP) solutions and 2D/3D heterogeneous integration concepts.
• Validation & Test Integration: Familiarity with Application-Specific Integrated Circuit (ASIC) verification and validation testing requirements at the circuit card level.
• Trade Studies & Optimization: Demonstrated ability to perform comprehensive design trade studies evaluating cost, weight, thermal packaging, and power benefits.
• Systems Engineering Tools: Familiarity with Model-Based Systems Engineering (MBSE) methodologies and CAMEO software

Pay Information

Full-Time Salary Range: $129000.00 - $239600.00

At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well‑being, and help you grow—both professionally and personally.

The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.

Benefits offered: Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.

• Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.
• For (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.