ElectroMechanical Design Engineer Sr: MicroElectronics

Lockheed Martin; Grand Prairie (TX); On-site; USD 85,000 - 158,000; Full time

Benefits offered by this job

Medical, Dental, Vision

Flexible work arrangements

401(k) match

Job summary

Lockheed Martin Missiles and Fire Control seeks an ElectroMechanical Design Engineer to advance 2D/3D heterogeneous packaging concepts for aerospace and defense applications in Grand Prairie, TX or Orlando, FL. You will design, prototype and test packaging solutions alongside senior engineers.

The role emphasizes CREO/Windchill, hardware and packaging design, and mentoring junior engineers while contributing to TRL readiness and risk assessments for new packaging concepts.

Qualifications

• DoD Secret level clearance or ability to obtain one.
• Working knowledge of CREO and Windchill.
• Geometric Dimensioning and Tolerancing, and tolerance stack-up analysis.
• Packaging design experience.
• Hardware design experience.
• Must be a U.S. citizen.

Responsibilities

• Conceiving and modeling 2D/3D package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
• Collaborating with cross functional teams to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.

Skills

DoD Secret clearance

CREO

Windchill

GD&T

Tolerance stack-up

Packaging design

Hardware design

U.S. citizen

Tools

Zuken E3

Mentor

Job description

Standard Job Description

You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at LockheedMartin Missiles &Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.

Standard Job Description

You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at LockheedMartin Missiles &Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.

What You Will Be Doing

As the ElectroMechanical Design Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with LockheedMartin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include:

• Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.


• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.


• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.


• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.


• Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.


• Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.


• Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.


• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.


• Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.

Why Join Us

Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security, Learn more about Lockheed Martin’s comprehensive benefits package here.

Further Information About This Opportunity

This position is in Orlando or Grand Prairie. Discover more about our Orlando, Florida location. Discover more about our Dallas, Texas location.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.

Applies electrical, electronic and mechanical principles to components and systems, including assembly, analysis, and documentation of results; construction of developmental assemblies, sub-assemblies and components; and quality testing. Supports and participates in the design, test, modification, fabrication and assembly of prototype electromechanical systems.

Basic Qualifications

• DoD Secret level clearance or be able to obtain one.


• Working knowledge of CREO and Windchill


• Geometric Dimensioning and Tolerancing, and tolerance stack-up analysis


• Packaging design experience


• Hardware design experience


• MUST BE A U.S. CITIZEN

Desired Skills

• Experience with Zuken E3 and Mentor


• CCA design and development


• IDX File transfer


• Flex design


• Cable and harness design


• Micro Electronics experience.

Pay Information

Full-Time Salary Range: $85300.00 - $158300.00

At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally.

The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.

Benefits offered

Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.

• Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.


• For (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.