ElectroMechanical Packaging Engineer (Hardware Protection Focus)

Lockheed Martin; Orlando (FL); On-site; USD 105,000 - 195,000; Full time

Benefits offered by this job

Medical

Dental

Vision

401(k) match

Paid time off

Holidays

Parental Leave

EAP

Flexible Spending Accounts

Education Assistance

Job summary

Lockheed MartinMissiles and Fire Control (MFC) seeks a Staff Electromechanical Design Engineer to lead hardware for 3DHI packaging. You will drive technical strategy, own critical designs, and mentor engineers across IPTs while ensuring reliability in harsh environments.

Responsibilities include overseeing heat transfer, structural integrity, FEA-based simulations, packaging qualification, and risk management. Travel may be required for program meetings and reviews.

Qualifications

• Bachelor of Science in Electrical or Mechanical Engineering or closely related STEM field; Master’s/PhD preferred or 15+ years of experience without a degree.
• 3D Heterogeneous Integration (3DHI) experience.
• Advanced Packaging experience.
• Technical or project leadership in high-reliability electronics.

Responsibilities

• Owns package hardware design including substrates, heat spreaders, stiffeners, and thermal management for 3DHI packages.
• Lead FEM/Multiphysics analyses for thermal, power integrity, and mechanical stress.
• Define and execute package qualification plans to JEDEC/MIL-SPEC standards.
• Mentor engineers and coordinate cross-functional teams to deliver hardware on schedule.

Skills

3DHI

Advanced Packaging

Technical leadership

Electromechanical design

Microelectronics design

CREO modeling

Earned value management

Cross-functional collaboration

Education

B.S. in Electrical or Mechanical Engineering

Master’s degree or PhD preferred

15+ years of experience

Tools

FEA

CREO

Job description

Standard Job Description

Lockheed Martin Missiles and Fire Control (MFC) is seeking a Staff Electromechanical Design Engineer to serve as a technical authority and hardware lead within our electromechanical engineering organization, specializing in 3D Heterogeneous Integration (3DHI). MFC is a recognized designer, developer, and manufacturer of precision engagement aerospace and defense systems for the U.S. and allied militaries. This role is suited for an experienced electromechanical professional who can drive technical strategy, lead IPT efforts, mentor engineers, and ensure mission-critical hardware meets the highest standards of reliability and performance.

What You Will Be Doing

Microelectronics hardware development engineer with ownership of package hardware design, heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed 3DHI packages throughout their operational lifespans.

• Design multichip package devices, including package substrates, Integrated Heat Spreaders and attach mechanism, stiffeners, and complex thermal management system integration to manage high thermal dissipation requirements.
• Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including operation shock and vibration.
• Define and execute packaging qualification plans adhering to project requirements, JEDEC and MIL-SPEC standardizations (e.g., Highly Accelerated Stress Testing / HAST).
• Investigate and perform failure analysis loops on critical component interface and intermetallic connections including anomalies like cracked solder joints, delaminated layers, and warped package substrates. Implement corrective actions to mitigate identified failure modes in manufacturing and incorporate findings into product revisions while capturing lessons learned for future development activity.
• Architecting, designing, and validating advanced circuit card packages
• Designing high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraints
• Designing and developing electromechanical systems for advanced programs, special programs, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and sub-assemblies
• Leading and documenting design assurance reviews, tracking issues, and driving corrective actions to closure
• Performing thermal, signal integrity, and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environments
• Coordinating with cross-functional teams — systems, hardware, software, test, and supply chain — to deliver high-quality results on schedule and within budget
• Managing risk, schedule, and earned value metrics, and reporting status to senior leadership
• Setting clear technical direction for program engineers based on customer requests and program goals
• Mentoring and developing engineers, fostering an inclusive environment and driving continuous improvement initiatives
• Communicating technical status, risks, and recommendations clearly to internal stakeholders and external customers

This position offers the opportunity to shape the future of electromechanical engineering capabilities at Lockheed Martin and to have a significant impact across the MFC enterprise.

Candidates may be subject to a government security investigation and must meet eligibility requirements for access to classified information. Some travel may be required.

Basic Qualifications

• Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university; Master’s degree or PhD preferred or Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree
• 3D Heterogeneous Integration (3DHI)
• Advanced Packaging
• Technical or project leadership experience supporting the production of high-reliability electronics products
• Microelectronics design
• Proficient in CREO modeling and electromechanical system design
• Project leadership/management experience throughout the engineering/production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM)
• Experience in presentation, oral and written communication to facilitate effective and efficient interchanges between co-workers, leaders, and customers
• Experience working with cross-functional teams across multiple locations
• Experience capturing flowed and derived requirements for electromechanical designs
• Must be a US Citizen; must possess or be able to obtain a DoD Secret security clearance

Desired Skills

• Thermal Interface Materials (TIM1/TIM2), Lid Attach, Package Stiffener Rings, JEDEC Qualification, HAST, Thermo-mechanical Stress
• Multiphysics modeling
• Direct experience supporting production (manufacturing and test)
• Demonstrated leadership skills and behaviors that align with Full Spectrum Leadership Imperatives
• Preparation for and participation in major program design reviews (PDR, CDR)
• Experience troubleshooting and resolving technical issues
• Proven understanding of electronics standards and processes
• Proven understanding of mechanical standards and processes
• Proven understanding of electronic packaging principles
• Demonstrated ability to multitask and adapt to changing priorities
• Experience with military defense hardware
• Experience with parts and materials selections
• Ability to perform design trade studies evaluating cost, weight, packaging, and power benefits
• Flex circuit and microelectronics design experience
• Active DoD Secret or Top Secret Clearance

Pay Information

Full-Time Salary Range: $104900.00 - $194700.00

At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally. The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.

Benefits offered

• Medical
• Dental
• Vision
• Flexible work arrangements and schedules (e.g., 4x10)
• 401(k) match
• Paid time off
• Holidays
• Parental Leave
• EAP
• Flexible Spending Accounts
• Education Assistance
• Life Insurance
• Short-Term Disability
• Long-Term Disability

• Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.
• For (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.