Director, SiP Architecture (2.5D/3D, HBM) Lead

EducationPals.ai

Northern (KY)

Hybrid

USD 240,000 - 300,000

Full time

7 days ago

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Benefits offered by this job

Paid Time Off

Company Holidays

Parental Leave

Happy Fridays

401k Matching

Flexible Spending Account (FSA)

Educational reimbursement up to $10,00

Donation Matching and volunteering

Corporate discount programs

Free Breakfast/Lunch/Dinner provided

Job summary

SK hynix America is seeking a Director-level engineer to lead end-to-end SiP architecture with emphasis on High Bandwidth Memory (HBM). The role requires steering cross-functional teams and aligning on roadmaps across engineering, product, and operations.

Ideal candidates have advanced packaging expertise (2.5D/3D), strong SI/PI skills, and a track record of delivering complex semiconductor solutions. On-site role with competitive compensation and benefits.

Qualifications

Master’s degree or PhD in Electrical Engineering, Materials Science, or related field.
+ years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies.
Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies.

Responsibilities

Lead the end-to-end development of advanced packaging system architectures with a focus on HBM.
Drive mechanical and electrical test vehicle design and development when necessary.
Spearhead research and development of novel technologies to enhance SiP performance and SOC/HBM integration.