Principal Engineer, Signal-Integrity and Power-Integrity

SK hynix America; San Jose (CA); On-site; USD 185,000 - 220,000; Full time

Benefits offered by this job

Top Tier health insurance

Paid time off + holidays

401k Matching

Educational reimbursement

Volunteer opportunities

Corporate discounts

Onsite meals provided

Job summary

SK hynix America is hiring a Principal Engineer to lead SIPI strategy for next‑gen packaging and HBM integration. You’ll drive architecture, validation, and sign‑off across the full stack from silicon to substrate in collaboration with global R&D teams.

The role demands deep experience in high‑speed interfaces, EM extraction, and industry standards, with a track record of guiding multi‑disciplinary teams to deliver robust packaging solutions.

Qualifications

• PhD or MS with extensive SIPI/packaging experience.
• Deep knowledge of 2.5D/3D packaging, HBM and interposers.
• Strong electronics design and verification background.

Responsibilities

• Define and own SIPI roadmap for advanced PKG families.
• Lead high‑performance SiP architectures across stack from silicon to substrate.
• Develop SIPI methodologies: EM extraction, multi‑port S‑parameters, PI analysis.
• Oversee end‑to‑end design flow: definition, simulation, layout sign‑off, tape‑out.
• Mentor engineers and drive cross‑team knowledge sharing.
• Conduct risk assessments and deliver SIPI sign‑off packages.

Skills

2.5D/3D packaging

HBM knowledge

SIPI signal integrity

Power integrity

Leadership

Mentorship

Communication

Education

Ph.D. in Electrical Engineering

Masters + 5 years related experience

Tools

Ansys SIwave

RedHawk

Cadence Sigrity

Job description

Job Title: Principal Engineer, Signal‑Integrity and Power‑Integrity

Office Location: San Jose, CA

Work Model: Onsite

About SK hynix America

At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting‑edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.

We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco‑friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.

Job Summary:

SK hynix America is seeking a Principal Engineer to lead the Signal‑Integrity and Power‑Integrity (SIPI) strategy for next‑generation advanced packaging technologies. In this role, you will lead the design, analysis, and validation of next generation advanced packaging solutions for HBM and beyond HBM such as logic‑memory integration. The position requires deep technical expertise in high‑speed interface design, collaboration with global R&D teams, and contributions to industry standards for advanced packaging.

Responsibilities:

• Strategic Leadership: Define and own the SIPI roadmap for advanced PKG families, aligning technical direction with product and business goals.
• Architecture & Design: Lead the creation of high‑performance SiP architectures (HBM, interposer, 3D stacks) and validate power‑delivery and signal‑integrity across the full stack—from silicon to substrate.
• Methodology Development: Invent and propagate best‑practice SIPI methodologies, including electromagnetic extraction, multi‑port S‑parameter modeling, and power‑network analysis for complex packaging environments.
• Technical Ownership: Oversee the end‑to‑end design flow (package definition, simulation, layout sign‑off, tape‑out) and drive continuous improvement of tools, scripts, and automation.
• Mentorship & Talent Development: Coach senior and junior engineers, fostering expertise in SIPI analysis, tool usage, and design verification; champion knowledge‑sharing across global teams.
• Risk Management & Sign‑off: Conduct comprehensive risk assessments, lead design reviews, and deliver final SIPI sign‑off packages that meet performance, reliability, and schedule targets.

Qualifications:

• Education: Ph.D. in Electrical Engineering, or a related field (or Master’s degree with 5+ years of relevant industry experience).
• Experience: ≥5years of hands‑on SIPI engineering in advanced semiconductor packaging.
• Technical Expertise: Deep knowledge of 2.5D/3D package architectures, HBM, interposer, TSV, high‑speed I/O standards, and power‑delivery networks. Proven proficiency with SIPI simulation tools (e.g., Ansys SIwave/RedHawk, Cadence Sigrity).
• Design Flow Mastery: Strong background in electromagnetic extraction, multi‑port S‑parameter analysis, power‑network optimization, and tape‑out sign‑off processes for complex packages.
• Leadership Skills: Demonstrated ability to influence multi‑disciplinary teams, drive technical decisions, and mentor senior engineers.
• Communication: Excellent verbal and written communication skills; ability to present complex technical concepts to both engineering and executive audiences.

Preferred Qualifications:

• Hands‑on experience with 2.5D/3D packaging for HBM, interposers, or GPU‑memory integration.
• Expertise in power integrity (PI) for 3D‑stacked memory systems, including PDN impedance profiling and IBIS model validation for HBM.
• In‑depth familiarity with industry standards such as PCIe Gen5/Gen6, CXL, UCIe, and JEDEC memory specifications.
• Familiarity with advanced packaging workflows from ball map definition to tape‑out for interposer‑based designs.
• Proficiency in scripting/automation (Python, TCL, SKILL) to create custom analysis flows and improve productivity.
• Experience validating high‑speed memory interfaces using oscilloscopes, VNAs, and compliance test platforms specific to 3D packaging.
• History of published technical papers, patents, or conference presentations in advanced packaging or SIPI.

Benefits:

• Top Tier health insurance at no employee cost
• Paid day offs: PTO + Company Holidays + Happy Fridays
• Paid Parental Leave Program
• 401k Matching
• Educational reimbursement up to Ten Thousand Dollars per year
• Donation Matching and volunteering opportunities
• Corporate discount programs
• Free Breakfast/Lunch/Dinner provided to employees

Equal Employment Opportunity:

SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.

Compensation:Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job‑related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.

Pay Range: $185,000 USD - $220,000 USD