Director of Hardware Platform Design & Packaging

Point2 Technology

San Jose (CA)

On-site

USD 180,000 - 240,000

Full time

14 days+

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Job summary

Point2 Technology in Silicon Valley seeks a Director of Hardware Platform Design to lead architecture, design, and execution of advanced hardware packaging platforms from concept through mass production. You will own package architecture, SI/PI, thermal and mechanical reliability, production test strategy, and cross-functional hardware integration while building and leading an engineering organization.

Responsibilities include owning end-to-end package design strategy, leading high-speed SI/PI,

Qualifications

PhD in EE with 10+ years or MS with 14+ years in hardware packaging.
Expertise in advanced semiconductor packaging and high-density interconnects.
Proven leadership of multidisciplinary engineering teams from concept to production.

Responsibilities

Own end-to-end package design strategy including routing, stack-up, and materials.
Lead SI/PI, high-speed and RF integrity architecture, modeling and optimization.
Direct thermal and mechanical reliability analysis and warpage optimization.
Build and lead multidisciplinary engineering teams across SI/PI, layout, thermal, and mechanical.
Develop production test methodologies with Test and Product Engineering.
Drive system integration across package, PCB, and system levels.