Director of Engineering - Semiconductor / IC Packaging

Ledgent Technology; Sunnyvale (CA); On-site; USD 185,000 - 225,000; Full time

Job summary

Ledgent Technology in Sunnyvale invites a Director of Engineering for semiconductor packaging. You will drive technology platforms, promote market adoption, and align customer requirements with development roadmaps across Sales, Factory Engineering, and R&D.

The role requires 12+ years in semiconductor packaging, expertise in 2.5D/3D, chiplet architectures, and system-in-package solutions, plus strong communication skills to engage customers and industry partners. Travel to events is common.

Qualifications

• Bachelor's, Master's, or PhD in Electrical, Materials, Mechanical, Chemical Engineering, or Physics.
• 12+ years in semiconductor industry, with packaging experience.
• Strong verbal and written communication; proven proposals and reports.
• Experience with DOE, BOM, and thermo-mechanical assessments.

Responsibilities

• Promote strategic technology platforms to global customers.
• Provide technical leadership in engagements with customer engineering teams.
• Translate customer roadmaps into packaging strategies and business opportunities.
• Represent the company at industry events and forums.
• Drive partnerships leading to new business opportunities and design wins.

Skills

Semiconductor packaging

Chiplet architectures

2.5D/3D integration

System-in-Package

Customer engagement

Education

Bachelor’s/Master’s/PhD in Electrical, Materials, Mechanical, Chemical Engineering, or Physics

Tools

FEA

HFSS

CFD

Cadence APD

Job description

Director of Engineering - Semiconductor / IC Packaging (JN -072026-425987) Sunnyvale, California

Director of Engineering - Semiconductor / Advanced IC Packaging

Location: Austin, TX

Salary: 185k – 225k per year

SUMMARY:

The primary goal of this position is to promote and drive market adoption, ecosystem leadership, and revenue growth of specific strategic technologies and advanced packaging platforms, including chiplet and package architectures, 2.5D/3D integration, heterogeneous integration, and system-in-package solutions, to global customers through engagement with customer engineers and technologists across their global organizations from IC design, package and system architects, manufacturing and market applications, as well as through conferences and industry forums. This position serves as the critical bridge between market demand and technology innovation, translating customer product roadmaps and industry trends into packaging technology strategies and business opportunities through deep technical dialogue, early-stage architecture influence, and ecosystem collaboration.

Working in close partnership with Sales, Factory engineering, and R&D teams, the Director aligns customer requirements with technology development roadmaps and packaging innovation strategy. Advise factory engineering teams on technology innovations and technology qualifications in collaboration with foundry partners, equipment suppliers, materials providers and industry consortia to strengthen leadership in heterogeneous integration technology. The ultimate objective is to represent the company in industry forums, conferences, and consortia to expand strategic customer partnerships, and translate advanced packaging technology leadership into sustained revenue growth and market differentiation.

Responsibilities

ESSENTIAL DUTIES AND RESPONSIBILITIES include the following, other duties may beassigned: The Director Engineering, Marketing & Technical Promotion is responsible forpromotion of strategic technology platforms to global customers. This role provides technicalleadership in engagements with customer engineering organizations, including design,technology and product development. The Director works closely with factory engineering,R&D, and Sales to align customer technology requirements with development roadmaps, and business growth objectives.

The successful candidate must be a persuasive communicator capable of engaging both technicaland business audiences within the organization as well as external partners, customers, and industry professionals. The role includes representing the company at industry events, conferences, and technical forums to promote capabilities, technology leadership, and competitive advantages.

Other responsibilities include:

• Develop technology and service promotion strategies with key customers by understanding their business drivers, IC applications, system architectures, and market positions
• Create technical marketing materials (presentations, white papers, and technical briefings) to effectively communicate the company's capabilities and technology differentiation
• Deliver technical presentations and engage with customer design, packaging and system teams to promote and positionour technologies for next-generation products
• Collaborate with application engineering and Sales to promote technical capabilities, roadmaps, and manufacturing strengths
• Facilitate communication between customers and internal engineering teams to address technology gaps and support product deployment. Contribute long-term roadmap development with manufacturing and R&D organizations
• Advise internal stakeholders on customer technology trends, competitive positioning, andkey technical issues
• Drive technology engagements that lead to new business opportunities and design wins, increasing adoption of the company'sstrategic platforms
• Support executive management in shaping long-term advanced packaging technology andbusiness strategies

EDUCATION and/or EXPERIENCE:

We prefer candidates with a Bachelor’s, Master’s, orPh.D. in Electrical, Materials, Mechanical, or Chemical Engineering, Physics, or a related field,with 12+ years of semiconductor industry experience, preferably in semiconductor packagingor advanced packaging technologies.

Candidates should have experience managing strategic customer accounts and strong verbal,written, and interpersonal communication skills. The role requires the ability to deliver technicalpresentations, develop customer proposals, and provide structured progress reports.

Strongorganizational and computer skills are required.

• Proven ability to analyze technology and market trends to define and execute short-term and long-term business strategies
• Strong understanding of semiconductor device physics, packaging technologies, and manufacturing processes, including flip chip, bumping, 2.5D/3D, high-density fan-out, and silicon photonics integration
• Familiarity with emerging trends such as chiplet integration, advanced interconnects, substrate innovations, and electrical and thermo-mechanical performance optimization, and advanced manufacturing processes
• Knowledge of packaging reliability, defect analysis, and qualification processes
• Experience in package development, architecture planning, and SI/PI performance analysis at package and PCB system levels
• Experience with DOE methodologies, BOM development, and thermo-mechanical assessments
• Working knowledge of engineering simulation tools (e.g., FEA, HFSS, CFD, Cadence APD) is a plus
• Proven strong ability to work independently and collaborate effectively with customers, vendors, and internal teams to develop and support advanced packaging technologies
• Active participation in industry networks or professional societies is highly desirable