Director of Hardware Platform Design

Point2 Technology; San Jose (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Point2 Technology in Silicon Valley seeks a Director of Hardware Platform Design to lead architecture, design, and execution of advanced hardware packaging platforms from concept through mass production. You will own package architecture, SI/PI, thermal and mechanical reliability, production test strategy, and cross-functional hardware integration while building and leading an engineering organization.

Responsibilities include owning end-to-end package design strategy, leading high-speed SI/PI,

Qualifications

• PhD in EE with 10+ years or MS with 14+ years in hardware packaging.
• Expertise in advanced semiconductor packaging and high-density interconnects.
• Proven leadership of multidisciplinary engineering teams from concept to production.

Responsibilities

• Own end-to-end package design strategy including routing, stack-up, and materials.
• Lead SI/PI, high-speed and RF integrity architecture, modeling and optimization.
• Direct thermal and mechanical reliability analysis and warpage optimization.
• Build and lead multidisciplinary engineering teams across SI/PI, layout, thermal, and mechanical.
• Develop production test methodologies with Test and Product Engineering.
• Drive system integration across package, PCB, and system levels.

Skills

Leadership

Project management

Cross-functional collaboration

Communication

Strategic thinking

Education

PhD in Electrical Engineering

MS in Electrical Engineering

Tools

Electromagnetic simulation tools

Thermal simulation tools

SI/PI modeling tools

Job description

Seeking a Director of Hardware Platform Design to lead the architecture, design, and execution of advanced hardware packaging platforms from concept through high-volume manufacturing. Own package architecture, SI/PI, thermal and mechanical reliability, production test strategy, and cross-functional hardware integration while building and leading an engineering organization.

Responsibilities

• Package Design Strategy: Own the end-to-end package design strategy, including bump/ball map definition, substrate routing architecture, package stack-up, and material selection.
• Signal & Power Integrity: Lead high-speed and RF signal integrity (SI) and power integrity (PI) architecture, modeling, simulation, and optimization.
• Thermal & Mechanical Reliability: Direct thermal and thermomechanical analysis, stress modeling, and warpage optimization to ensure package reliability throughout product qualification and mass production.
• Engineering Leadership: Build and lead multidisciplinary teams across SI/PI, package layout, thermal, and mechanical engineering.
• Production Test: Partner with Test and Product Engineering to develop comprehensive production test methodologies.
• System Integration: Lead hardware platform integration across package module, PCB, and system levels.

Qualifications

• Ph.D. in Electrical Engineering (or related field) with 10+ years of industry experience, or M.S. with 14+ years.
• Expertise in advanced semiconductor packaging, substrate design, and high-density interconnects.
• Strong knowledge of SI/PI, thermal analysis, and mechanical reliability.
• Experience with electromagnetic, SI/PI, and thermal simulation tools.
• Proven success leading multidisciplinary engineering teams and complex hardware programs from concept through production.
• Strong leadership, communication, project management, and cross-functional collaboration skills.

Locations