Staff Process Engineer, APTD Bonding — Yield & Quality

Micron Technology, Inc.; Boise (ID); On-site; USD 80,000 - 110,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid family leave

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking a Process Engineer for the APTD Bonding team in Boise, Idaho. In this role, you will be focused on developing, optimizing, and troubleshooting processes to enhance product quality and reliability.

The ideal candidate will hold a BS in a relevant field and have at least 5 years of relevant experience in semiconductor process engineering. The position offers substantial benefits including medical, dental, and vision plans.

Qualifications

• 5 years of relevant industry experience required.
• Experience in semiconductor process engineering and packaging is essential.
• Knowledge of DRAM, NAND, or other memory products is beneficial.

Responsibilities

• Develop and optimize processes to improve product quality.
• Resolve manufacturing line problems using FMEA or SPC methodology.
• Coordinate process evaluations and implement changes.

Skills

Advanced package integration knowledge

Design of experiment techniques (DOE)

Statistical Process Control (SPC)

Root-cause problem solving

Data analysis skills

Education

BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics

Job description

Micron Technology, Inc. is seeking a Process Engineer for the APTD Bonding team in Boise, Idaho. In this role, you will be focused on developing, optimizing, and troubleshooting processes to enhance product quality and reliability.

The ideal candidate will hold a BS in a relevant field and have at least 5 years of relevant experience in semiconductor process engineering. The position offers substantial benefits including medical, dental, and vision plans.