AI-Driven Packaging Design Engineer (2.5D/3D)

AMD

Austin (TX)

In loco

USD 110.000 - 160.000

Tempo pieno

5 giorni fa

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Descrizione del lavoro

AMD in Austin is seeking a Package Design Engineer to advance complex package design execution for heterogeneous integration. You will lead end-to-end design projects, deliver high-quality substrates and interposers, and drive design decisions with SI/PI, mechanical, and SOC teams.

The role emphasizes ownership, fast-paced execution, AI-driven design techniques, and scalable workflows. Candidates should have a strong background in electrical or computer engineering and experience with advanced

Competenze

Bachelor's or higher degree in Electrical Engineering, Computer Engineering, or related field.
Experience with complex substrate design or interposer architectures.
Familiarity with AI-driven design techniques and automation.

Mansioni

Design end-to-end package designs for complex products, meeting performance, cost, quality, and schedule targets.
Lead multiple concurrent design programs in fast-paced environments.
Develop substrate layouts, bump maps, interposer designs for 2.5D/3D packaging.
Collaborate with SI/PI, mechanical, and SOC teams to drive design decisions.