3D-IC & SoC CAD Engineer — AI-Driven Automation

AMD; Austin (TX); On-site; USD 180,000 - 240,000; Full time

Job summary

AMD in Austin, TX is seeking a highly skilled CAD engineer to advance 3D-IC and advanced packaging flows from RTL to signoff. You will lead hands-on debugging of large netlists and partner with Synopsys and Cadence on AI-enabled CAD solutions.

The ideal candidate combines a strong silicon hardware background with scripting proficiency in Python/TCL/Perl, plus experience applying ML/LLM techniques to CAD workflows. This role emphasizes collaboration across global teams.

Qualifications

• Strong understanding of industry EDA tools, with emphasis on place-and-route, extraction, and analysis tools.
• Familiarity with chip- or system-level netlists and ability to debug connectivity across DEF/LEF/SPEF/Verilog/UPF/OAS/GDS formats.
• Exposure with system level design verification processes including LEC, LVS, DRC.
• Comfort navigating large datasets and utilizing automation, distributed and cloud compute environments.
• Demonstrated experience applying AI (ML-based optimization, LLM-assisted automation, agentic frameworks) to CAD, EDA, or hardware design problems.
• Strong scripting skills in Python, TCL, and Perl within a Linux/Unix environment.
• Experience with advanced-node tapeouts across silicon technologies.
• Exposure to Advanced Packaging technologies (2.5D, 3D, 3.5D) preferred.

Responsibilities

• Implement and maintain 3D‑IC and advanced packaging design flows from RTL through signoff.
• Lead hands‑on debug and automation involving large chip level physical and logical netlists.
• Partner with EDA vendors on 3D‑IC feature requirements, enhancement requests, and AI co‑development opportunities.
• Partake in deep‑dive discussions to provide guidelines to various organizations across AMD.
• Develop and integrate end‑to‑end AI capabilities into CAD flows — including ML‑based optimization, predictive modeling, and LLM‑assisted automation.
• Define strategy and key initiatives to ensure flows meet future design requirements and advanced technology nodes.
• Regress methodology, analyze results, and develop capabilities that measurably improve quality of results.
• Work closely with design and CAD implementation teams to deliver tools and flows meeting key QoR metrics: Timing, Area, and Performance.

Skills

EDA tools

Place-and-route

Netlists debugging

Python scripting

LLM automation

Linux environment

AI in CAD

Education

Bachelor or Master in CSE/EE

Tools

ICC2

Innovus

Primetime

DEF/LEF/Verilog

UPF/OAS

GDS

Job description

AMD in Austin, TX is seeking a highly skilled CAD engineer to advance 3D-IC and advanced packaging flows from RTL to signoff. You will lead hands-on debugging of large netlists and partner with Synopsys and Cadence on AI-enabled CAD solutions.

The ideal candidate combines a strong silicon hardware background with scripting proficiency in Python/TCL/Perl, plus experience applying ML/LLM techniques to CAD workflows. This role emphasizes collaboration across global teams.