Data Center Packaging Engineering Leader

AMD; Santa Clara (CA); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

AMD is seeking a visionary leader to drive the design execution of next-generation Data Center GPU and MI package programs. You will guide cross-functional teams across design, SI/PI, OSAT partners, and management to deliver high-performance, high-complexity packages on aggressive timelines.

The role emphasizes AI-enabled methodologies, process innovation, and collaboration with global teams to scale execution and ensure manufacturability and yield optimization.

Qualifications

• Ideal candidate has strong program management and leadership skills.
• Experience leading multi-program design teams in fast-paced environments.
• Strong understanding of package layout and high-speed design considerations.

Responsibilities

• Lead end-to-end execution of Data Center GPU/MI package design programs, ensuring schedule, quality, and cost targets.
• Drive execution in high-pressure environments, managing competing priorities across programs.
• Interface with senior leadership to provide clear program status, risks, and mitigation strategies.

Skills

Program management

Leadership

Cross-functional collaboration

Stakeholder management

Communication

Decision making under pressure

Ambiguity handling

Education

B.S. or higher in EE/CE/ME or related field

Tools

Synopsys 3DICC

Cadence SiP / APD

Job description

AMD is seeking a visionary leader to drive the design execution of next-generation Data Center GPU and MI package programs. You will guide cross-functional teams across design, SI/PI, OSAT partners, and management to deliver high-performance, high-complexity packages on aggressive timelines.

The role emphasizes AI-enabled methodologies, process innovation, and collaboration with global teams to scale execution and ensure manufacturability and yield optimization.