AI-Driven IC Package Design Engineer

Apple Inc.; Los Angeles (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Apple Inc. is seeking a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies.

You will shape architecture, scalability, and efficiency for next-generation products, advancing design methodologies through automation and AI. As a Package Design Engineer, you will lead architecture, own PHY design from concept to tape-out, and collaborate with cross-functional teams to deliver optimized SI/PI

Qualifications

• BS degree in engineering or related field
• 10+ years of relevant industry experience required
• Experience with IC package physical design is essential

Responsibilities

• Perform physical layout of package substrates for diverse silicon (SoC, memory, RF, cellular).
• Execute parasitic extraction (RLGC) and S-parameter modeling to validate SI/PI performance targets.
• Lead cross-functional collaboration on package feasibility and system co-optimization; align with Product Design on floorplan and Silicon/SIPI on electrical performance.
• Drive package design methodology improvements by evaluating new CAD tools and developing automated design and verification flows.

Skills

Package design

High-speed SI/PI

Manufacturing knowledge

Automation scripting

Education

Bachelor's degree

Tools

Cadence Allegro

Mentor Xpedition

Calibre

CAM350

HFSS

PowerSI

Job description

Apple Inc. is seeking a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies.

You will shape architecture, scalability, and efficiency for next-generation products, advancing design methodologies through automation and AI. As a Package Design Engineer, you will lead architecture, own PHY design from concept to tape-out, and collaborate with cross-functional teams to deliver optimized SI/PI