IC Package Design Engineer

Apple Inc.; Los Angeles (CA); Vor Ort; USD 180.000 - 240.000; Vollzeit

Zusammenfassung

Apple Inc. is seeking a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies.

You will shape architecture, scalability, and efficiency for next-generation products, advancing design methodologies through automation and AI. As a Package Design Engineer, you will lead architecture, own PHY design from concept to tape-out, and collaborate with cross-functional teams to deliver optimized SI/PI

Qualifikationen

• BS degree in engineering or related field
• 10+ years of relevant industry experience required
• Experience with IC package physical design is essential

Aufgaben

• Perform physical layout of package substrates for diverse silicon (SoC, memory, RF, cellular).
• Execute parasitic extraction (RLGC) and S-parameter modeling to validate SI/PI performance targets.
• Lead cross-functional collaboration on package feasibility and system co-optimization; align with Product Design on floorplan and Silicon/SIPI on electrical performance.
• Drive package design methodology improvements by evaluating new CAD tools and developing automated design and verification flows.

Kenntnisse

Package design

High-speed SI/PI

Manufacturing knowledge

Automation scripting

Ausbildung

Bachelor's degree

Tools

Cadence Allegro

Mentor Xpedition

Calibre

CAM350

HFSS

PowerSI

Jobbeschreibung

Summary

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI.

Description

As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape-out. You will collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies You are expected to leverage AI tools to enhance design efficiency, quality and performance.

Key Responsibilities

• Perform physical layout of package substrates for diverse silicon, including System-on-Chip (SoC), Memory, RF, and cellular integrated circuits (ICs).
• Execute parasitic extraction (RLGC) and S-parameter modeling to validate that package designs meet Signal and Power Integrity (SI/PI) performance targets.
• Lead cross-functional collaboration on package feasibility and system co-optimization; align with Product Design on chip floorplan, System Architecture on package configuration, and Silicon/SIPI teams on electrical performance.
• Drive package design methodology improvements by evaluating new CAD tools and developing automated design and verification flows to enhance efficiency and streamline the release process.

Minimum Qualifications

• BS and 10+ years of relevant industry experience

Preferred Qualifications

• Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350).
• High-Speed & SI/PI Expertise: Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters).
• Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM) and various sophisticated package configurations and assembly technology
• Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.