Advanced Packaging R&D Intern — SiP & Interposer Focus
Semiengineering
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Job summary
Keysight Technologies, within Keysight Labs/High Frequency Technology Center in Santa Rosa, seeks a Semiconductor Advanced Packaging Process Engineering Intern to contribute to the development and optimization of next-generation heterogeneous integration and advanced packaging technologies.
You will work alongside process and manufacturing engineers to support the development, characterization, and continuous improvement of semiconductor assembly processes used to manufacture advanced
Responsibilities
- Assist development and optimization of advanced packaging processes.
- Support characterization of semiconductor assembly processes for SiP products.
- Collaborate with process and manufacturing engineers.
Job description
Keysight Technologies, within Keysight Labs/High Frequency Technology Center in Santa Rosa, seeks a Semiconductor Advanced Packaging Process Engineering Intern to contribute to the development and optimization of next-generation heterogeneous integration and advanced packaging technologies.
You will work alongside process and manufacturing engineers to support the development, characterization, and continuous improvement of semiconductor assembly processes used to manufacture advanced
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