Semiconductor Advanced Packaging Process Engineering Intern Keysight

Semiengineering; Santa Rosa (CA); On-site; USD 28,000 - 41,000; Part time

Job summary

Keysight Technologies, within Keysight Labs/High Frequency Technology Center in Santa Rosa, seeks a Semiconductor Advanced Packaging Process Engineering Intern to contribute to the development and optimization of next-generation heterogeneous integration and advanced packaging technologies.

You will work alongside process and manufacturing engineers to support the development, characterization, and continuous improvement of semiconductor assembly processes used to manufacture advanced

Responsibilities

• Assist development and optimization of advanced packaging processes.
• Support characterization of semiconductor assembly processes for SiP products.
• Collaborate with process and manufacturing engineers.

Job description

As a Semiconductor Advanced Packaging Process Engineering Intern within the Keysight Labs/High Frequency Technology Center, you will contribute to the development and optimization of next-generation heterogeneous integration and advanced packaging technologies. Working alongside process and manufacturing engineers, you will support the development, characterization, and continuous improvement of semiconductor assembly processes used to manufacture advanced System-in-Package (SiP) products and interposer technologies.