Semiconductor Advanced Packaging Intern: Process Eng

Keysight Technologies SAles Spain SL.

Santa Rosa (CA)

On-site

USD 59,000 - 79,000

Full time

14 days+

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Job summary

Keysight Technologies is offering an internship in the Semiconductor Advanced Packaging group at the Keysight Labs/High Frequency Technology Center in California. The role focuses on developing and optimizing heterogeneous integration and advanced packaging technologies for SiP products and interposers, working with process and manufacturing engineers.

Ideal candidates are enrolled in MS/PhD programs and have hands-on lab experience, strong analytical skills, and the ability to communicate

Qualifications

Pursuing an MS or PhD in a technical field and enrolled by Sep 2027.
Experience in semiconductor processing or related areas is preferred.
Strong analytical and communication skills for collaborative work.
Hands-on laboratory or engineering project experience.

Responsibilities

Plan, execute, and document engineering experiments to evaluate process, material, and equipment performance.
Collect and analyze process, metrology, and electrical data to identify trends and improvements.
Work with advanced semiconductor assembly equipment (thermocompression bonding, pick-and-place, inspection).
Support development activities aimed at improving cycle time, throughput, yield, and robustness.
Execute hands-on experiments, collect data, and implement process improvements with engineers.
Assist in failure analysis, defect characterization, and troubleshooting.