Semiconductor Packaging Architect, Heterogeneous Integration

Keysight Technologies

Santa Rosa (CA)

On-site

USD 126,930 - 211,550

Full time

14 days+

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Benefits offered by this job

Medical, dental and vision
401(k) Plan
Flexible Time Off
Tuition Reimbursement
ESPP
Restricted Stock Units
Paid Holidays

Job summary

Keysight Technologies in Santa Rosa, CA seeks an experienced packaging architect focused on design enablement and advanced packaging for SiP modules. You will collaborate with upstream design teams to define packaging architectures, develop manufacturability guidelines, and drive heterogeneous integration across microwave and mmWave subsystems.

Ideal candidates have 3+ years in semiconductor manufacturing, strong analytical and communication skills, and a track record of cross‑functional

Qualifications

  • 3+ years of semiconductor manufacturing industry experience (internships/lab work/research considered)
  • Strong analytical and problem‑solving skills
  • Ability to collaborate across design, process, and manufacturing teams
  • Excellent communication skills for technical discussions and cross‑functional alignment

Responsibilities

  • Collaborate with design, process, and manufacturing teams to define packaging architectures.
  • Develop rules for manufacturability and reliability.
  • Evaluate new materials and advanced packaging concepts.
  • Conduct feasibility studies and risk assessments.
  • Support tech transfer and prototype builds; analyze performance data.
  • Lead projects in heterogeneous integration and advanced packaging for emerging markets.
  • Monitor KPI targets and report progress to management.

Skills

Analytical skills
Problem‑solving
Communication skills

Education

B.S., M.S., or Ph.D. in relevant engineering field

Job description

Keysight Technologies in Santa Rosa, CA seeks an experienced packaging architect focused on design enablement and advanced packaging for SiP modules. You will collaborate with upstream design teams to define packaging architectures, develop manufacturability guidelines, and drive heterogeneous integration across microwave and mmWave subsystems.

Ideal candidates have 3+ years in semiconductor manufacturing, strong analytical and communication skills, and a track record of cross‑functional

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