Innovative RF Packaging & Signal Integrity Intern

Keysight Technologies SAles Spain SL.

Colorado Springs (CO)

On-site

USD 50,000 - 54,000

Full time

2 days ago
Be an early applicant
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Job summary

Keysight in Colorado Springs is seeking a motivated engineer to design, optimize, and implement ASIC packaging and subsystem solutions. You will work with global teams to meet test & measurement product functionality, performance, quality and schedule requirements.

Responsibilities include ASIC package/module development, SI/PI analysis, power delivery design, RF interconnect modeling, and collaboration with system, IC design, and test teams to define hardware architecture and requirements.

Qualifications

  • Pursuing BS, MS or PhD in Electrical/Mechanical/Materials Engineering or equivalent.
  • CAD Modeling and/or Simulation coursework and in-school experience.
  • Understanding of Electrical Engineering and RF signal integrity principles.

Responsibilities

  • ASIC package, module, and subsystem development including layout, integration, SI/PI analysis, and power delivery network design.
  • Modeling & optimization of high-frequency RF and high-speed digital I/O interconnects.
  • Close collaboration with system, IC design, and test teams to develop and define hardware architecture, requirements, functionality, and performance.
  • Collaboration with the test & reliability teams in the characterization and qualification of each ASIC.
  • Lifecycle support for existing ASIC components.

Skills

RF signal integrity
Electrical engineering
CAD modeling

Education

BS/MS/PhD in Electrical/Mechanical/Materials Engineering

Job description

Keysight in Colorado Springs is seeking a motivated engineer to design, optimize, and implement ASIC packaging and subsystem solutions. You will work with global teams to meet test & measurement product functionality, performance, quality and schedule requirements.

Responsibilities include ASIC package/module development, SI/PI analysis, power delivery design, RF interconnect modeling, and collaboration with system, IC design, and test teams to define hardware architecture and requirements.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

R&D Hardware Design Engineer — ASIC Packaging & RF
R&D Hardware Design Engineer — ASIC Packaging & RF

Keysight Technologies SAles Spain SL. • Colorado Springs (CO)

On-site
USD 86,000 - 144,000
Medical, dental and vision
401(k) Plan
Flexible Time Off
R&D Hardware Design Engineer – RF/High-Speed ASICs | RSUs
R&D Hardware Design Engineer – RF/High-Speed ASICs | RSUs

Keysight Technologies • Colorado Springs (CO)

On-site
USD 86,000 - 144,000
Medical, dental and vision
Health Savings Account
401(k) Plan
+3
R&D Packaging and Signal Integrity Intern
R&D Packaging and Signal Integrity Intern

Keysight Technologies SAles Spain SL. • Colorado Springs (CO)

On-site
USD 50,000 - 54,000
R&D Engineer 2, Hardware
R&D Engineer 2, Hardware

Keysight Technologies SAles Spain SL. • Colorado Springs (CO)

On-site
USD 86,000 - 144,000
Medical, dental and vision
401(k) Plan
Flexible Time Off
R&D Hardware Design Engineer
R&D Hardware Design Engineer

Keysight Technologies SAles Spain SL. • Colorado Springs (CO)

On-site
USD 115,200 - 192,000
Medical, dental and vision
401(k) Plan
Flexible Time Off
R&D Hardware Design Engineer: ASIC Packaging & RF
R&D Hardware Design Engineer: ASIC Packaging & RF

Keysight Technologies SAles Spain SL. • Colorado Springs (CO)

On-site
USD 115,200 - 192,000
Medical, dental and vision
401(k) Plan
Flexible Time Off
R&D Engineer 2, Hardware
R&D Engineer 2, Hardware

Keysight Technologies • Colorado Springs (CO)

On-site
USD 86,000 - 144,000
Medical, dental and vision
Health Savings Account
401(k) Plan
+3
Senior IC Packaging Engineer - SI & PI
Senior IC Packaging Engineer - SI & PI

Blue Origin • Van Horn (TX)

On-site
USD 230,000 - 323,000
Relocation provided
Travel up to 10%
Senior IC Packaging & SI Engineer — RF/mmWave
Senior IC Packaging & SI Engineer — RF/mmWave

Blue Origin • San Francisco (CA)

On-site
USD 230,000 - 323,000
Relocation provided
Travel up to 10%
Technical assessment during interviews
Senior Packaging Engineer: SI/PI for High-Speed ATE
Senior Packaging Engineer: SI/PI for High-Speed ATE

Teradyne • North Reading (MA)

On-site
USD 175,000 - 281,000