Advanced Packaging Process Engineer

Intel Corporation

Hillsboro (OR)

On-site

USD 134,000 - 255,000

Full time

2 days ago

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Benefits offered by this job

Health benefits

Stock bonuses

Retirement plan

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon, is seeking a Process Integration Engineer to lead the design and development of sophisticated manufacturing processes for high-volume manufacturing and next-generation technologies. You will drive technology development, pathfinding, and equipment optimization in close collaboration with suppliers and internal teams.

The successful candidate will have a Master's degree with 4+ years of experience (or PhD with 3+ years) in related fields, with hands-on

Qualifications

Master's degree with 4+ years of relevant industry experience or PhD with 3+ years in related fields.
Experience in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
Hands-on robotics, automation, vision systems, or image processing.

Responsibilities

Drive technology development for high-volume manufacturing and future technology nodes.
Lead design and development of manufacturing processes, including materials, parameters, equipment metrology, and system design.
Perform pathfinding activities and develop technology roadmaps for future devices.
Recommend and implement equipment modifications to improve production efficiency and capacity.
Collaborate with suppliers to develop enabling elements of technology and roadmaps.
Conduct feasibility studies using theory and practical engineering methods.
Stay updated on semiconductor process trends and industry needs.
Apply SPC and DOE principles to drive data-informed decisions.