Advanced Packaging Metrology Lead

Intel Corporation; Hillsboro (OR); On-site; USD 156,000 - 255,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement benefits

Vacation benefits

Job summary

Intel Corporation in Hillsboro, Oregon is seeking an Advanced Packaging Metrology Engineering Manager to lead a high‑performing team at the cutting edge of wafer‑level packaging technology.

You will drive long‑term technology strategies, enable manufacturing readiness, and partner across disciplines to deliver robust solutions while upholding safety, quality, and cost targets. This role emphasizes leadership, strategic thinking, and collaboration within a global manufacturing context.

Qualifications

• Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience; OR Master’s degree in a related STEM field with 4+ years of relevant experience; OR PhD in a related STEM field with 4+ years of relevant experience.
• Relevant experience can be any of the following: Semiconductor wafer or assembly process, equipment, or materials development. Process development methodology, project management, and schedule‑based execution.
• Hybrid bonding interconnects (HBI), redistribution layer (RDL) packaging, and ultra‑fine pitch solder connections.
• Lead programs from strategy formation through high‑volume production.

Responsibilities

• Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology.
• Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap.
• Ensure successful demonstrations of manufacturing capabilities at high volumes and manage seamless technology transfers to global manufacturing sites.
• Partner with cross‑functional teams — including integration, device, and yield engineering — to deliver process solutions that meet device specifications while optimizing safety, quality, and cost.
• Collaborate with supplier executive management to identify and implement innovative concepts into manufacturing processes.
• Execute long‑term strategies for module engineering to support future technology needs and market demands.
• Set clear, measurable team objectives and apply differentiated performance management to consistently drive results.
• Coach, mentor, and develop engineers in skills growth, technology road mapping, and pathfinding for future innovations.
• Foster a collaborative, inclusive, and psychologically safe team environment that encourages bold thinking and accountability.

Skills

Leadership

Communication

Strategic thinking

Collaboration

Coaching

Problem solving

Resilience

Inclusivity

Education

Bachelor’s degree in STEM

Master’s degree in STEM

PhD in STEM

Job description

Intel Corporation in Hillsboro, Oregon is seeking an Advanced Packaging Metrology Engineering Manager to lead a high‑performing team at the cutting edge of wafer‑level packaging technology.

You will drive long‑term technology strategies, enable manufacturing readiness, and partner across disciplines to deliver robust solutions while upholding safety, quality, and cost targets. This role emphasizes leadership, strategic thinking, and collaboration within a global manufacturing context.