Advanced Packaging Metrology Engineering Manager

Intel Corporation; Hillsboro (OR); On-site; USD 156,000 - 255,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement benefits

Vacation benefits

Job summary

Intel Corporation in Hillsboro, Oregon is seeking an Advanced Packaging Metrology Engineering Manager to lead a high‑performing team at the cutting edge of wafer‑level packaging technology.

You will drive long‑term technology strategies, enable manufacturing readiness, and partner across disciplines to deliver robust solutions while upholding safety, quality, and cost targets. This role emphasizes leadership, strategic thinking, and collaboration within a global manufacturing context.

Qualifications

• Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience; OR Master’s degree in a related STEM field with 4+ years of relevant experience; OR PhD in a related STEM field with 4+ years of relevant experience.
• Relevant experience can be any of the following: Semiconductor wafer or assembly process, equipment, or materials development. Process development methodology, project management, and schedule‑based execution.
• Hybrid bonding interconnects (HBI), redistribution layer (RDL) packaging, and ultra‑fine pitch solder connections.
• Lead programs from strategy formation through high‑volume production.

Responsibilities

• Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology.
• Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap.
• Ensure successful demonstrations of manufacturing capabilities at high volumes and manage seamless technology transfers to global manufacturing sites.
• Partner with cross‑functional teams — including integration, device, and yield engineering — to deliver process solutions that meet device specifications while optimizing safety, quality, and cost.
• Collaborate with supplier executive management to identify and implement innovative concepts into manufacturing processes.
• Execute long‑term strategies for module engineering to support future technology needs and market demands.
• Set clear, measurable team objectives and apply differentiated performance management to consistently drive results.
• Coach, mentor, and develop engineers in skills growth, technology road mapping, and pathfinding for future innovations.
• Foster a collaborative, inclusive, and psychologically safe team environment that encourages bold thinking and accountability.

Skills

Leadership

Communication

Strategic thinking

Collaboration

Coaching

Problem solving

Resilience

Inclusivity

Education

Bachelor’s degree in STEM

Master’s degree in STEM

PhD in STEM

Job description

Job Details

Intel Corporation is a global technology leader at the forefront of semiconductor innovation, dedicated to creating world-changing technology that improves the lives of every person on the planet. Intel's Wafer-Level Assembly Technology Development (WATD) group is a dynamic, forward‑thinking organization focused on developing next‑generation packaging technologies. With a culture built on collaboration, inclusion, and relentless innovation, Intel offers an environment where your work truly matters — and where the future of technology is being written every day. We are seeking a visionary and technically accomplished Advanced Packaging Metrology Engineering Manager to lead a high‑performing team of engineers at the cutting edge of advanced semiconductor packaging. In this pivotal role, you will drive innovation in wafer‑level assembly technologies, champion manufacturing readiness, and deliver results that reinforce Intel's position as a global technology leader. You will shape the future of advanced packaging by enabling robust process pathways, executing long‑term technology strategies, and cultivating a team culture rooted in excellence, accountability, and collaboration.

Key Responsibilities

• Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology.
• Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap.
• Ensure successful demonstrations of manufacturing capabilities at high volumes and manage seamless technology transfers to global manufacturing sites.
• Partner with cross‑functional teams — including integration, device, and yield engineering — to deliver process solutions that meet device specifications while optimizing safety, quality, and cost.
• Collaborate with supplier executive management to identify and implement innovative concepts into manufacturing processes.
• Execute long‑term strategies for module engineering to support future technology needs and market demands.
• Set clear, measurable team objectives and apply differentiated performance management to consistently drive results.
• Coach, mentor, and develop engineers in skills growth, technology road mapping, and pathfinding for future innovations.
• Foster a collaborative, inclusive, and psychologically safe team environment that encourages bold thinking and accountability.

As a Successful Candidate, You Will Bring

• A Natural Leader — You inspire confidence, motivate teams, and bring out the best in the people around you.
• A Clear Communicator — You articulate complex ideas with clarity and adapt your communication style to diverse audiences.
• A Strategic Thinker — You see the big picture while staying grounded in the details that matter.
• A Collaborative Partner — You thrive in cross‑functional environments and build strong relationships with stakeholders at all levels.
• A Coach and Mentor — You are genuinely invested in the growth and development of your team members.
• An Innovative Problem‑Solver — You approach challenges with curiosity, creativity, and a solutions‑oriented mindset.
• Resilient and Adaptable — You navigate ambiguity with composure and lead your team through change with confidence.
• Inclusive and Empathetic — You champion diversity of thought and create environments where everyone feels valued and heard.

Minimum Qualifications

• Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience; OR Master's degree in a related STEM field with 4+ years of relevant experience; OR PhD in a related STEM field with 4+ years of relevant experience.
• Relevant experience can be any of the following: Semiconductor wafer or assembly process, equipment, or materials development. Process development methodology, project management, and schedule‑based execution.

Preferred Qualifications

• 4+ years of experience in: Metrology area Managerial position Wafer‑level assembly or wafer‑level packaging research and development.
• Technical leadership in process development for semiconductor manufacturing.
• Hybrid bonded interconnects (HBI), redistribution layer (RDL) packaging, and ultra‑fine pitch solder connections.
• Lead programs from strategy formation through high‑volume production.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

EEO Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

• Competitive pay
• Stock bonuses
• Health benefits
• Retirement benefits
• Vacation benefits

Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US

$155,520.00-255,200.00 USD

Work Model for this Role

This role will require an on-site presence.

Job Posting Details

Job posting details (such as work model, location or time type) are subject to change.

Additional Information

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.