Advanced Packaging Lithography Development Manager

Intel; Hillsboro (OR); On-site; USD 155,520 - 298,440; Full time

Job summary

Intel Foundry is seeking an Advanced Packaging Lithography Module Development Manager to lead lithography development for next‑generation packaging solutions. This role will manage a team of process engineers while shaping patterning flow and process development for Foveros Direct technologies.

Based in Hillsboro, OR, this on‑site position offers the opportunity to influence Intel’s roadmap, partner with cross‑functional teams, and enable manufacturing excellence for next‑generation computing

Qualifications

• Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• 6+ years of relevant experience with a master’s degree, or 5+ years of experience with a PhD degree.
• Equipment mastery: deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment.
• Process development: extensive experience in lithography process optimization, yield enhancement, and manufacturing readiness.
• Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.

Responsibilities

• Lead and manage a team of engineers, setting goals, evaluating performance, and coaching for innovation.
• Formulate long-term process roadmaps to keep Intel ahead in advanced packaging.
• Foster talent development within the etch team and drive technical excellence.
• Develop and execute project schedules, track milestones and cross‑functional feedback.
• Drive lithography module yield improvement and defect reduction initiatives.
• Partner with process integration and manufacturing operations to ensure seamless tech transfer.

Skills

Team leadership

Project management

DOE principles

Cross-functional collaboration

Process optimization

Education

Master or PhD in Physics or Engineering

Tools

Scanner/stepper systems (ASML, Canon, Nikon)

Track equipment

Job description

Job Description

Intel Foundry is seeking an Advanced Packaging Lithography Module Development Manager to lead our lithography development for next‑generation packaging solutions. This role will drive the development and implementation of lithography equipment and processes critical to Intel’s industry‑leading advanced packaging portfolio, focused on Foveros Direct technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in patterning flow definition and process development. This position offers the opportunity to influence Intel’s roadmap for technology leadership, manufacturing excellence, and enabling next‑generation computing solutions.

Key Responsibilities

• Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
• Formulate long‑term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
• Foster talent development for critical technical roles, and drive technical excellence and innovation within the etch team
• Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross‑functional teams
• Drive lithography module and segment related yield improvement initiatives and defect reduction programs
• Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high‑volume manufacturing

The Candidate Should Exhibit The Following Behavioral Traits

• Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.
• Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.

Qualifications

Minimum Qualifications

• Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• 6+ years of relevant experience with a master’s degree, or 5+ years of experience with a PhD degree.

The experience listed above should include a combination of the following qualifications:

• Equipment Mastery: Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment
• Process Development: Extensive experience in lithography process optimization, yield enhancement, and/or manufacturing readiness
• Project management experience, including developing schedules, tracking deliverables, and managing cross‑functional collaborations.

Preferred Qualifications

• Demonstrated ability to build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.
• Experience with vendor relations, including material quality assessments and performance management.
• Strong knowledge of Design of Experiments (DOE) principles, problem‑solving methodologies, and package interconnect technologies

Job Information

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00 - 298,440.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

This role will require an on‑site presence. Job posting details (such as work model, location or time type) are subject to change.