3D IC Integration Enablement Engineer

GlobalFoundries; Town of Malta (NY); On-site; USD 65,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a motivated R&D design enablement engineer for its 300mm Malta, NY facility. You will contribute to 3D heterogeneous integration and advanced packaging R&D, translating packaging requirements into device enablement specs and supporting test vehicle/tapeout workflows.

The role requires PhD or Master’s in Electrical Engineering or Materials Science with a strong academic record, excellent English communication, and up to 10% travel.

Qualifications

• PhD or Master’s in Electrical Engineering and/or Materials Science from an accredited program.
• Overall GPA of 3.0 or better at the time of graduation.
• Fluent written and verbal English communication.

Responsibilities

• Publish Design Manual specifications for packaging requirements.
• Align DM/PDK with device enablement specs (design rules, LVS, device model terminals).
• Develop test vehicle content specifications and manage tapeout/test processes.

Skills

English proficiency

Travel up to 10%

Education

PhD in Electrical Engineering or Materials Science

GPA 3.0 or higher

Job description

GlobalFoundries is seeking a motivated R&D design enablement engineer for its 300mm Malta, NY facility. You will contribute to 3D heterogeneous integration and advanced packaging R&D, translating packaging requirements into device enablement specs and supporting test vehicle/tapeout workflows.

The role requires PhD or Master’s in Electrical Engineering or Materials Science with a strong academic record, excellent English communication, and up to 10% travel.