3D Chiplet Architect — High-Bandwidth Memory Packaging

Vertical Compute SRL; United States; Remote; USD 180,000 - 230,000; Full time

Job summary

Vertical Compute SRL is seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D packaging strategies for the VIM technology. You will shape interconnect approaches and die stacking to enable high-bandwidth, low-power operation across SoC and package boundaries.

The role requires 5–10 years in advanced packaging, deep SoC design knowledge, and strong collaboration across design, process, and system teams.

Qualifications

• 5–10 years in 2.5D/3D packaging and heterogeneous integration.
• Deep understanding of SoC physical design, TSVs, redistribution layers, and hybrid bonding.
• Experience running multi-physics simulations (thermal, electrical, mechanical) for full system.
• Ability to collaborate across design, process, and system teams.
• Excellent English communication.

Responsibilities

• Define architectures for 2.5D/3D stacking of VIM chiplets with compute chiplets.
• Develop interconnect solutions ensuring high bandwidth and low latency.
• Define fabrication flows and design rules with foundries and packaging partners.
• Lead cross-functional technical teams and provide guidance.
• Present at conferences and industry events as needed.

Skills

2.5D/3D packaging

SoC physical design

TSVs & Redistribution Layers

Hybrid bonding

Multi-physics simulations

Leadership & mentorship

Tools

Integrity 3D-IC Platform

Power/thermal analysis tools

LVS/STA/SI/PI tools

Job description

Vertical Compute SRL is seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D packaging strategies for the VIM technology. You will shape interconnect approaches and die stacking to enable high-bandwidth, low-power operation across SoC and package boundaries.

The role requires 5–10 years in advanced packaging, deep SoC design knowledge, and strong collaboration across design, process, and system teams.