Die-to-Wafer Process Engineer — R&D & NPI

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a semiconductor process engineer to develop, optimize, and qualify Die-to-Wafer processes including Flip Chip and Underfill for advanced packaging applications.

You will support process readiness, yield improvement, and NPI, and maintain MES data and process instructions for development builds. You will collaborate with NPI, Operations, Quality and Equipment teams to transfer technology, qualify processes, and ensure robust manufacturing readiness in

Qualifications

• Bachelor's degree in Engineering (Mechanical, Materials, Electronics, or related).
• 3–5 years of hands-on semiconductor process engineering experience preferred.
• Experience in D2W, Flip Chip, Underfill or advanced packaging is an advantage.
• Strong problem-solving and analytical skills.
• Good communication; ability to work with cross-functional teams.
• Ability to work independently and manage multiple activities in a fast-paced environment.
• Fresh engineering graduates with interest in semiconductor process development are welcome to apply.

Responsibilities

• Develop and qualify D2W processes, including Flipchip and Underfill, for advanced packaging applications such as 2.5D, Fan-In, and Fan-Out.
• Perform hands-on process setup, DOE, optimization, characterization, and continuous improvement using JMP.
• Support process and yield improvement to achieve robust and scalable manufacturing processes.
• Develop and review FMEA, OCAP and Control Plans to identify and mitigate process risks.
• Create and maintain MES process flows, recipes, process instructions, BOM, and device information for R&D builds.
• Support process monitoring and reporting, including staging-time and yield monitoring, to facilitate transition to NPI.
• Collaborate with NPI, Operations, Quality and Equipment teams to support process qualification, technology transfer and manufacturing readiness.

Skills

D2W process engineering

Die-to-Wafer

Flip Chip

Underfill

DOE

JMP tooling

Analytical skills

Cross-functional teamwork

Independent work

Education

Bachelor's degree in Engineering

Tools

JMP

MES

Job description

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a semiconductor process engineer to develop, optimize, and qualify Die-to-Wafer processes including Flip Chip and Underfill for advanced packaging applications.

You will support process readiness, yield improvement, and NPI, and maintain MES data and process instructions for development builds. You will collaborate with NPI, Operations, Quality and Equipment teams to transfer technology, qualify processes, and ensure robust manufacturing readiness in