R&D Die-to-Wafer Process Engineer — Advanced Packaging

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Benefits offered by this job

Competitive remuneration package

Comprehensive benefits

Job summary

PEOPLE PROFILERS PTE. LTD. is seeking a qualified Semiconductor Process Engineer to support Flipchip and Underfill development and qualification for advanced packaging applications.

You will contribute to improvements in yield, quality, and process robustness, while supporting customer programs, NPI and technology transfer. The role involves developing, optimizing, and qualifying Die-to-Wafer processes for advanced packaging, ensuring readiness and robust processes across development to

Qualifications

• Bachelor's degree in Engineering or related field required.
• 3–5 years hands-on semiconductor process engineering experience preferred.
• Experience with Die-to-Wafer, Flip Chip, Underfill or advanced packaging is advantageous.
• Strong analytical and problem-solving abilities required.
• Good communication and cross-functional collaboration skills.
• Ability to manage multiple activities in a fast-paced environment.

Responsibilities

• Support Flipchip and Underfill process development and qualification.
• Improve process yield, quality, capability and manufacturing robustness.
• Support customer programs, NPI and technology transfer.
• Develop, optimize and qualify D2W processes for advanced packaging.
• Ensure process readiness, yield improvements and robustness for customer solutions.
• Establish and maintain R&D flows, recipes and MES data for qualification builds.

Skills

Semiconductor process engineering

Die-to-Wafer

Flip Chip

Underfill

Problem solving

Communication

Cross-functional teamwork

Independent work

Education

Bachelor's degree in Engineering

Tools

MES

Job description

PEOPLE PROFILERS PTE. LTD. is seeking a qualified Semiconductor Process Engineer to support Flipchip and Underfill development and qualification for advanced packaging applications.

You will contribute to improvements in yield, quality, and process robustness, while supporting customer programs, NPI and technology transfer. The role involves developing, optimizing, and qualifying Die-to-Wafer processes for advanced packaging, ensuring readiness and robust processes across development to