Lead Process Engineer, Advanced Packaging

GlobalFoundries inc.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

GlobalFoundries Singapore seeks an Experienced Equipment Engineer to join the 300mm Advance Packaging Center. You will develop and optimize diffusion/etch processes for multi-stack bond wafer and Die-to-Wafer workflows, starting up new processes while ensuring reliability and yield targets.

The role requires hands-on tooling start-up, collaboration with the equipment team, and ownership of process and tool performance in manufacturing.

Qualifications

• BS/MS/PhD in EE/chemical/physics or related discipline is required.
• Experience with bonder tools (TEL W2W/BESI D2W) and annealing processes.
• Excellent verbal and written communication skills; good cross-cultural collaboration.

Responsibilities

• Design, run, and analyze experiments to develop advanced packaging etch processes.
• Startup and qualify new processes and equipment within timelines.
• Collaborate with equipment engineers on new equipment acceptance and tool matching.
• Improve process robustness for high-volume manufacturing using DOE and statistics.
• Coach peers on advance packaging etch process knowledge.

Skills

Communication

Interpersonal skills

DOE techniques

Data-driven decision making

Problem solving

Process optimization

Education

BS/MS/PhD in Electrical/Chemical Engineering or related physical science

Tools

TEL W2W

BESI D2W

Annealing & Die re-constitution tooling

Job description

GlobalFoundries Singapore seeks an Experienced Equipment Engineer to join the 300mm Advance Packaging Center. You will develop and optimize diffusion/etch processes for multi-stack bond wafer and Die-to-Wafer workflows, starting up new processes while ensuring reliability and yield targets.

The role requires hands-on tooling start-up, collaboration with the equipment team, and ownership of process and tool performance in manufacturing.