Senior Process Module Engineer, 2.5D/3D Advanced Packaging

GlobalFoundries; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

GlobalFoundries Singapore seeks an Experienced Member of Technical Staff (MTS) / Principal Process Engineer to join our 300mm Advanced Packaging Center. You will develop and optimize advanced packaging processes (bond & debond, pre-bond, plasma/UV cleaning, die reconstitution, annealing and TSV) for multi-stack wafer / D2W workflows.

You will lead cross-functional teams, start-up tooling, qualify new equipment, drive process robustness with DOE and statistical methods, and coach peers while

Qualifications

• BS, MSc or PhD in engineering discipline as specified with 4+ / 6+ / 8+ years in advanced packaging.
• Experience leading fab-wide cross-modules process development and project coordination.
• Hands-on experience with advanced packaging processes (Si interposer, D2W, W2W).
• Excellent verbal and written communication; strong interpersonal skills.

Responsibilities

• Design, execute and analyze experiments to develop advanced packaging etch and related processes.
• Startup and qualify new processes and equipment within scheduled timelines.
• Collaborate with Equipment Engineers on new equipment acceptance and tool matching.
• Improve process robustness using DOE, data-driven decisions and lean methods.
• Coach and develop engineers in advance packaging knowledge and best practices.

Skills

Fab-wide coordination

Advanced packaging tools

Verbal & written comms

Interpersonal skills

DOE & statistics

Education

Electrical Engineering

Materials Science & Eng

Chemical Engineering

Physics or related

Tools

Si interposer tools

D2W process tools

W2W process tools

Job description

GlobalFoundries Singapore seeks an Experienced Member of Technical Staff (MTS) / Principal Process Engineer to join our 300mm Advanced Packaging Center. You will develop and optimize advanced packaging processes (bond & debond, pre-bond, plasma/UV cleaning, die reconstitution, annealing and TSV) for multi-stack wafer / D2W workflows.

You will lead cross-functional teams, start-up tooling, qualify new equipment, drive process robustness with DOE and statistical methods, and coach peers while